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74AUP1G157GN

NXP Semiconductors

74AUP1G157GN by NXP Semiconductors

74AUP1G157GN by NXP Semiconductors is a compact CMOS multiplexer with a 21.9 ns propagation delay and operates b/w 0.8V to 3.6V, making it ideal for automotive applications. It features dual inputs and a small outline package for efficient space utilization. With a wide temp range of -40 °C to 125 °C, it's perfect for demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 147,000 parts In-Stock

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Vyrian

USA . 8,244 parts In-Stock

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Digiode

USA . 2,771 parts In-Stock

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Anansix

USA . 1,554 parts In-Stock

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Native Components

USA . 1,046 parts In-Stock

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$0.964

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Northwest PG Solutions

USA . 1,755 parts In-Stock

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$0.980

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AZTECH Wire

Italy . 13,728 parts In-Stock

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$5.890

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One Stop Electronics

USA . 407 parts In-Stock

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$35.000

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RC Electronics

USA . 6,750 parts In-Stock

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$0.190

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Corphita

USA . 3,776 parts In-Stock

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UNI Independent Distributors

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Supply Digital

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Kepictronics

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Perfect Parts

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Overview

Unlock the potential of your designs with the 74AUP1G157GN multiplexer from NXP Semiconductors, a leader in innovative semiconductor solutions. This compact, high-quality device offers exceptional performance in demanding applications, ensuring reliable functionality even in extreme temperatures. Its low power consumption and fast switching capabilities empower engineers to create efficient, cutting-edge devices, making it the perfect choice for automotive and consumer electronics. Experience unparalleled value and reliability with NXP, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs, enabling space-saving and efficient PCB layout.

No. of Inputs: 2

With 2 inputs, this multiplexer offers versatile data routing, suitable for simple switching tasks.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into existing designs while maximizing space on the PCB.

Nominal Supply Voltage / Vsup: 1.1 V

The low nominal supply voltage indicates lower power consumption, making it ideal for battery-powered applications.

No. of Terminals: 6

A 6-terminal design provides ample connectivity options while maintaining a compact size.

Package Style (Meter): SMALL OUTLINE

The small outline package style is perfect for applications where space is a premium, such as in handheld devices.

Propagation Delay (tpd): 21.9 ns

A propagation delay of 21.9 ns ensures fast switching times, contributing to efficient data handling.

Maximum Operating Temperature: 125 °C

High thermal tolerance makes this product suitable for automotive and high-temperature applications.

Minimum Operating Temperature: -40 °C

Operating effectively even at -40 °C, this product can be used in outdoor and harsh environmental conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable long-term performance.

Terminal Position: DUAL

The dual terminal position allows for flexible layout options on PCBs, enhancing design versatility.

Maximum Seated Height: 0.35 mm

The low seated height contributes to a slim profile, making it suitable for ultra-thin device designs.

Width: 0.9 mm

A narrow width allows for density in layout designs, essential for modern compact electronics.

Output Polarity: TRUE

True output polarity ensures predictable performance in various digital applications.

Minimum Supply Voltage (Vsup): 0.8 V

A minimum supply voltage of 0.8 V allows for compatibility with low-voltage systems, expanding its applicability.

Length: 1 mm

The compact length maximizes space efficiency and fits well in small form-factor devices.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive use, ensuring reliability and compliance with stringent automotive standards.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a great fit for modern digital circuits.

Terminal Form: NO LEAD

No lead design minimizes footprint and enhances the soldering process, improving manufacturing efficiency.

Terminal Pitch: 0.3 mm

A terminal pitch of 0.3 mm supports high-density designs, accommodating compact circuit board layouts.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6 V, this component can operate effectively across a wide range of voltage levels.

Technical Specifications

Multiplexer & Demultiplexer 74AUP1G157GN attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

21.9 ns

Maximum Seated Height:

.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.3 mm

Terminal Position:

DUAL

Width:

.9 mm

Trade Compliance

74AUP1G157GN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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