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7603701EA

Texas Instruments

7603701EA by Texas Instruments

The Texas Instruments 7603701EA is a TTL multiplexer with 4 functions, 2 inputs, and 2 bits. It has a propagation delay of 35 ns at a supply voltage of 5V. Ideal for military applications due to MIL-STD-883 screening level and operating temperature range from -55°C to 125°C.

Median Price

$3.479

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 13 parts In-Stock

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$3.479

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Vyrian

USA . 5,412 parts In-Stock

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Digiode

USA . 1,289 parts In-Stock

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Resion

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Sogenti Electronics

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Electronics Depot

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Eagle Technology Solutions

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Mil-Aero Solutions, Inc.

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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Electronic Expediters

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Native Components

USA . 5 parts In-Stock

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$0.135

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$0.130

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Northwest PG Solutions

USA . 450 parts In-Stock

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$0.149

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Parana Technologies

USA . 551 parts In-Stock

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$15.639

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$1,452.326

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$14.075

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AZTECH Wire

Italy . 577 parts In-Stock

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DigiPath Technology Company

USA . 576 parts In-Stock

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ChromeModa Solutions

Germany . 5,459 parts In-Stock

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IDEA Electronic Components Group

UK . 410 parts In-Stock

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$16.693

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One Stop Electronics

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Component Stockers USA

USA . 389 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 17,593 parts In-Stock

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Microchip USA

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Corphita

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Glotronic Ltd.

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Overview

Elevate your electronic projects with the high-quality 7603701EA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this Multiplexer & Demultiplexer that offer unparalleled performance and reliability. Perfect for a wide range of applications, this versatile component provides customers with exceptional value, efficiency, and precision. Experience the advantages of Texas Instruments technology and take your designs to the next level with the 7603701EA.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability of the product, making it suitable for harsh environments.

Propagation Delay At Nominal Supply: 35 ns

Low propagation delay allows for fast signal processing, making this multiplexer/demultiplexer efficient in time-critical applications.

No. of Functions: 4

Having 4 functions in one device helps in consolidating circuitry and reducing component count, leading to cost savings and simplified design.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 standards ensures high quality and reliability, making this product suitable for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Operates on a standard 5V supply voltage, making it compatible with many electronic systems and easy to integrate.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this multiplexer/demultiplexer can withstand harsh environmental conditions without compromising performance.

Technology: TTL

Uses TTL technology which is known for its simplicity, high noise immunity, and easy interfacing with other digital circuits.

Technical Specifications

Multiplexer & Demultiplexer 7603701EA attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

35 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexer

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

7603701EA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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