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CD74HCT151MTG4

Texas Instruments

CD74HCT151MTG4 by Texas Instruments

CD74HCT151MTG4 by Texas Instruments is a CMOS multiplexer with 8 inputs, 57 ns propagation delay at 5V. It has a small outline package style and operates in temperatures ranging from -55 to 125°C. Ideal for military-grade applications requiring fast signal switching.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,077 parts In-Stock

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Digiode

USA . 3,620 parts In-Stock

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Native Components

USA . 41 parts In-Stock

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$1.789

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Northwest PG Solutions

USA . 1,250 parts In-Stock

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$1.968

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AZTECH Wire

Italy . 733 parts In-Stock

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$8.848

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One Stop Electronics

USA . 446 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,459 parts In-Stock

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$26.175

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$26.765

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DigiPath Technology Company

USA . 257 parts In-Stock

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$28.822

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IDEA Electronic Components Group

UK . 2,129 parts In-Stock

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$29.410

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$27.940

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$26.469

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ChromeModa Solutions

Germany . 607 parts In-Stock

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Corphita

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Overview

Get ready to experience top-notch performance and reliability with the Texas Instruments CD74HCT151MTG4 Multiplexer & Demultiplexer. Known for their superior quality and cutting-edge technology, Texas Instruments delivers innovative solutions for a wide range of applications. With fast propagation delay and a low load capacitance, this product offers unparalleled efficiency and precision. Whether you're working on a military-grade project or a commercial application, the CD74HCT151MTG4 is designed to meet your needs. Trust Texas Instruments to provide you with the value, benefits, and advantages you deserve. Elevate your projects to the next level with the CD74HCT151MTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring the longevity of the product.

Propagation Delay At Nominal Supply: 57 ns

Low propagation delay allows for quick and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology enables easy and compact integration of the multiplexer/demultiplexer onto PCBs, saving space and simplifying the assembly process.

No. of Inputs: 8

Having 8 inputs provides versatility and flexibility in routing multiple input signals to desired output channels.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes it compatible with many existing electronic systems and power sources.

Maximum I (ol): 4 Amp

High output current handling capacity of 4 Amps ensures that the multiplexer/demultiplexer can drive connected devices effectively without risk of overload.

Minimum Operating Temperature: -55 °C

Wide operating temperature range from -55°C to 125°C allows the device to function reliably in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic levels, making it an efficient choice for integrated circuits like multiplexers.

Technical Specifications

Multiplexer & Demultiplexer CD74HCT151MTG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

57 ns

Propagation Delay (tpd):

57 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HCT151MTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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