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7603701EX

Texas Instruments

7603701EX by Texas Instruments

The Texas Instruments 7603701EX is a MIL-STD-883 compliant multiplexer with 4 functions, 2 inputs, and 16 terminals. It operates b/w -55 to 125 °C with a propagation delay of 15 ns. Ideal for military applications requiring TTL technology in an in-line package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,408 parts In-Stock

1+ parts

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4,408

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Digiode

USA . 1,414 parts In-Stock

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1,414

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Distributors (Availability)

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Native Components

USA . 659 parts In-Stock

1+ parts

$0.090

100+ parts

-

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$0.086

659

$0.090

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$0.086

Northwest PG Solutions

USA . 630 parts In-Stock

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$0.099

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-

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$0.087

630

$0.099

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$0.087

Parana Technologies

USA . 1,989 parts In-Stock

1+ parts

$7.434

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-

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$7.923

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1,989

$7.434

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$7.923

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DigiPath Technology Company

USA . 687 parts In-Stock

1+ parts

$8.186

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687

$8.186

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ChromeModa Solutions

Germany . 2,469 parts In-Stock

1+ parts

$8.353

100+ parts

$6.849

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2,469

$8.353

$6.849

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

1+ parts

$8.353

100+ parts

$7.935

1k+ parts

$7.518

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-

1,848

$8.353

$7.935

$7.518

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AZTECH Wire

Italy . 512 parts In-Stock

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$16.448

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512

$16.448

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One Stop Electronics

USA . 1,132 parts In-Stock

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$19.000

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1,132

$19.000

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Corphita

USA . 2,028 parts In-Stock

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2,028

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Overview

Experience superior performance and reliability with the Texas Instruments 7603701EX Multiplexer & Demultiplexer. Known for their high-quality products, Texas Instruments delivers cutting-edge technology that exceeds industry standards. This versatile device is perfect for a wide range of applications, providing seamless switching between multiple inputs with minimal delay. Trust in Texas Instruments for top-of-the-line components that offer unparalleled value and efficiency, making your projects run smoother than ever before.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material is durable and provides good protection for the internal components, ensuring long-term reliability.

No. of Functions: 4

Having multiple functions in a single device can help save space on a circuit board and simplify the overall design.

Screening Level: MIL-STD-883

Compliance with this military standard ensures high quality and reliability, making it suitable for critical applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with a wide range of systems and power sources.

Propagation Delay (tpd): 15 ns

The fast propagation delay of 15 ns ensures efficient and timely signal processing, making it ideal for high-speed applications.

Output Characteristics: 3-STATE

The 3-state output allows the device to have a high impedance state, providing flexibility in connecting multiple devices on the same bus.

Temperature Grade: MILITARY

Designed to operate within the military temperature range of -55 to 125°C, ensuring reliability in harsh environments.

Technology: TTL

Using TTL technology offers good noise immunity and reliable operation, making it a popular choice for various applications.

Technical Specifications

Multiplexer & Demultiplexer 7603701EX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

15 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

7.62 mm

Trade Compliance

7603701EX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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