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SN74LVC157ADRG4

Texas Instruments

SN74LVC157ADRG4 by Texas Instruments

SN74LVC157ADRG4 by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 6.4 ns at 1.8V supply voltage. It operates in industrial temperature range (-40 to 85°C) and has a small outline package style, making it suitable for high-speed signal switching applications.

Median Price

$0.494

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26,748 parts In-Stock

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$0.494

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$0.380

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$0.200

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26,748

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Nova Conductors

Japan . 51 parts In-Stock

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$0.200

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$0.200

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Digiode

USA . 2,019 parts In-Stock

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$0.469

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Vyrian

USA . 7,574 parts In-Stock

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Electronics Depot

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Sea View Technologies

USA . 1,933 parts In-Stock

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Bristol Electronics

USA . 1,933 parts In-Stock

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Distributors (Availability)

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Argo Parts USA

USA . 4,165 parts In-Stock

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$0.200

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-

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$0.194

4,165

$0.200

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$0.194

Continental Prestige Electronics

USA . 2,790 parts In-Stock

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$0.200

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$0.196

2,790

$0.200

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$0.196

Ampacity Inc.

Singapore . 26,505 parts In-Stock

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$0.420

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$0.420

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Semicontronic

India . 26,469 parts In-Stock

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$0.420

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$0.410

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$0.407

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26,469

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$0.407

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Corphita

USA . 2,961 parts In-Stock

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$0.445

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AZTECH Wire

Italy . 1,106 parts In-Stock

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$14.520

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Parana Technologies

USA . 792 parts In-Stock

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$20.060

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$19.991

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792

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$19.991

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Corohmni

South Africa . 218 parts In-Stock

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$20.591

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DigiPath Technology Company

USA . 632 parts In-Stock

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$22.088

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ChromeModa Solutions

Germany . 4,566 parts In-Stock

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$22.539

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$18.482

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IDEA Electronic Components Group

UK . 1,950 parts In-Stock

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$22.539

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$21.412

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$20.285

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Perfect Parts

USA . 5,568 parts In-Stock

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Microchip USA

USA . 1,619 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Kepictronics

USA . 42 parts In-Stock

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Overview

Discover the innovative SN74LVC157ADRG4 by Texas Instruments, a top-of-the-line Multiplexer & Demultiplexer that guarantees high-quality performance and reliability. With a focus on precision engineering and cutting-edge technology, Texas Instruments delivers products that exceed industry standards. This versatile component is ideal for a wide range of applications, offering customers unbeatable value, efficiency, and seamless integration. Upgrade your projects with the SN74LVC157ADRG4 and experience the advantages of superior functionality and seamless operation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 6.4 ns

Low propagation delay ensures fast switching speed, ideal for time-sensitive applications.

Surface Mount: YES

Easily integrated onto PCBs, saving space and simplifying assembly processes.

No. of Functions: 4

Allows for multiple input/output combinations, increasing flexibility in signal routing.

No. of Inputs: 2

Sufficient number of inputs for handling diverse input signals.

Package Shape: RECTANGULAR

Standard package shape for easy compatibility with various mounting configurations.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage for efficient power consumption.

Load Capacitance (CL): 50 pF

Supports a moderate load capacitance for stable signal transmission.

Power Supplies (V): 3.3

Compatible with common power supply voltages, ensuring ease of integration.

No. of Terminals: 16

Adequate number of terminals for connecting multiple signals and power sources.

Package Style (Meter): SMALL OUTLINE

Compact package style for space-saving installation in compact electronic devices.

Maximum I (ol): 24 Amp

High output current capability for driving loads with ease.

Propagation Delay (tpd): 14 ns

Acceptable propagation delay for most applications requiring fast signal routing.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for various environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for reliable electrical connections and corrosion resistance.

Terminal Position: DUAL

Allows for easy identification and connection of input/output terminals.

Maximum Seated Height: 1.75 mm

Low profile design for space-constrained applications.

Width: 3.9 mm

Narrow width for efficient use of PCB real estate.

Output Polarity: TRUE

Ensures correct signal output polarity for compatibility with other components.

Minimum Supply Voltage (Vsup): 1.65 V

Wide range of supply voltage compatibility for versatile use.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly processes.

Length: 9.9 mm

Compact length for space-efficient placement on PCBs.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements for reliable operation in harsh environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting onto PCBs.

Packing Method: TR

Tape and reel packing method for convenient handling and automated assembly.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance for robust operation in various power supply scenarios.

Maximum Power Supply Current (ICC): 0.04 mA

Low power supply current requirement for energy-efficient operation.

Technical Specifications

Multiplexer & Demultiplexer SN74LVC157ADRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74LVC157ADRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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