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SN74HCT157NE4

Texas Instruments

SN74HCT157NE4 by Texas Instruments

SN74HCT157NE4 by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It operates at a supply voltage of 5V, has a propagation delay of 35ns, and can handle a load capacitance of 150pF. This industrial-grade device is ideal for applications requiring high-speed signal switching in temperature-sensitive environments.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,427 parts In-Stock

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Digiode

USA . 1,247 parts In-Stock

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Parana Technologies

USA . 734 parts In-Stock

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$13.996

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$14.468

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734

$13.996

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DigiPath Technology Company

USA . 1,836 parts In-Stock

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$15.411

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$14.179

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IDEA Electronic Components Group

UK . 1,827 parts In-Stock

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$15.726

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$14.940

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$14.153

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$15.726

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ChromeModa Solutions

Germany . 568 parts In-Stock

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$15.726

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$12.895

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568

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$12.895

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AZTECH Wire

Italy . 440 parts In-Stock

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$19.682

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One Stop Electronics

USA . 1,223 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Looking for a reliable multiplexer & demultiplexer for your next project? Look no further than the SN74HCT157NE4 by Texas Instruments. With a reputation for top-quality products, Texas Instruments delivers excellence in every component they manufacture. The SN74HCT157NE4 offers exceptional value with its fast propagation delay, multiple functions, and versatile applications. Trust Texas Instruments to provide you with the best-in-class solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring durability and reliability of the product.

Propagation Delay At Nominal Supply: 35 ns

Low propagation delay results in faster signal transmission, making it suitable for high-speed applications.

No. of Functions: 4

With 4 functions in one device, it offers increased functionality and flexibility in signal routing and processing.

No. of Inputs: 2

Having 2 inputs allows for versatile signal selection and routing capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with common electronic systems.

Load Capacitance (CL): 150 pF

Designed to work efficiently with a load capacitance of 150 pF, ensuring optimal performance in various circuit configurations.

Power Supplies (V): 5

The product is designed to operate with a single 5V power supply, simplifying the system design and integration.

No. of Terminals: 16

With 16 terminals, the device offers ample connectivity options for interfacing with other components or systems.

Maximum I (ol): 6 Amp

Capable of handling a maximum output current of 6A, making it suitable for applications requiring high current drive capability.

Propagation Delay (tpd): 52 ns

Although slightly higher than the nominal delay, the propagation delay of 52 ns is still relatively low, ensuring fast signal processing.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the device can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Designed to operate at temperatures as low as -40°C, ensuring reliable performance in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold finish on terminals provides enhanced conductivity, corrosion resistance, and longevity.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options and ease of connectivity in various system configurations.

Maximum Seated Height: 5.08 mm

With a low seated height of 5.08 mm, the device offers a compact form factor suitable for space-constrained applications.

Width: 7.62 mm

The compact width of 7.62 mm enables easy integration into circuit boards with limited space.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with standard logic levels.

Minimum Supply Voltage (Vsup): 4.5 V

The device can operate at a minimum supply voltage of 4.5V, providing flexibility in power supply options.

Length: 19.305 mm

The length of 19.305 mm offers a compact and efficient design, suitable for applications with space constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature requirements, ensuring reliable operation in harsh environmental conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ideal for battery-powered devices or noise-sensitive applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form factor provides secure and reliable connections for easy integration into circuit boards.

Packing Method: TUBE

Packed in tubes for convenient storage, handling, and transportation in manufacturing and assembly processes.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, the device offers compatibility with common PCB layouts and components.

Maximum Supply Voltage (Vsup): 5.5 V

Operates with a maximum supply voltage of 5.5V, providing a safe operating range and protection against voltage spikes.

Technical Specifications

Multiplexer & Demultiplexer SN74HCT157NE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

52 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexer

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74HCT157NE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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