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74LVC1G157GF,132

NXP Semiconductors

74LVC1G157GF,132 by NXP Semiconductors

NXP Semiconductors' 74LVC1G157GF,132 is a CMOS multiplexer with 2 inputs, 6.3 ns propagation delay, and 3.3V nominal voltage. Ideal for automotive applications due to its small outline package style and wide operating temperature range from -40°C to 125°C.

Median Price

$0.219

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,688 parts In-Stock

1+ parts

$0.403

100+ parts

$0.278

1k+ parts

-

10k+ parts

$0.090

2,688

$0.403

$0.278

-

$0.090

Rochester

USA . 106,577 parts In-Stock

1+ parts

-

100+ parts

$0.219

1k+ parts

$0.182

10k+ parts

$0.162

106,577

-

$0.219

$0.182

$0.162

Verical

USA . 90,000 parts In-Stock

1+ parts

-

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$0.203

90,000

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-

-

$0.203

Distributors (In-Stock)

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Digiode

USA . 4,556 parts In-Stock

1+ parts

$0.087

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-

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4,556

$0.087

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Nova Conductors

Japan . 10 parts In-Stock

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$0.156

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10

$0.156

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Chip Stock

USA . 69,000 parts In-Stock

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DigiKey Marketplace

USA . 27,782 parts In-Stock

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$0.100

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27,782

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$0.100

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Vyrian

USA . 2,023 parts In-Stock

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2,023

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VNN

France . 2,000 parts In-Stock

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Anansix

USA . 1,341 parts In-Stock

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1,341

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Distributors (Availability)

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Ampacity Inc.

Singapore . 38,936 parts In-Stock

1+ parts

$0.078

100+ parts

-

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38,936

$0.078

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Corphita

USA . 126 parts In-Stock

1+ parts

$0.083

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126

$0.083

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Component Stockers USA

USA . 36,959 parts In-Stock

1+ parts

$0.100

100+ parts

$0.090

1k+ parts

$0.080

10k+ parts

$0.080

36,959

$0.100

$0.090

$0.080

$0.080

AZTECH Wire

Italy . 11,865 parts In-Stock

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$0.110

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11,865

$0.110

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Aranea Global

USA . 1,000 parts In-Stock

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$0.153

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$0.146

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1,000

$0.153

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$0.146

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Argo Parts USA

USA . 2,780 parts In-Stock

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$0.156

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$0.151

2,780

$0.156

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$0.151

Microchip USA

USA . 2,514 parts In-Stock

1+ parts

$0.650

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2,514

$0.650

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Continental Prestige Electronics

USA . 112,804 parts In-Stock

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$0.111

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112,804

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$0.111

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UNI Independent Distributors

Spain . 5,145 parts In-Stock

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5,145

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Supply Digital

USA . 2,568 parts In-Stock

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2,568

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Overview

Experience the superior quality and reliability of NXP Semiconductors with the 74LVC1G157GF,132 multiplexer & demultiplexer. This versatile component offers fast propagation delay, low power consumption, and a wide operating temperature range, making it ideal for automotive applications and beyond. With its small outline and surface-mount design, this product provides customers with easy integration and space-saving solutions. Trust NXP Semiconductors to deliver cutting-edge technology that meets your needs and exceeds your expectations. Unlock the potential of your projects with the 74LVC1G157GF,132 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay allows for fast and efficient signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Ease of installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it versatile for use in various electronic systems.

Load Capacitance (CL): 50 pF

Suitable for driving capacitive loads without compromising performance or signal integrity.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, making it suitable for industrial and automotive applications.

Technology: CMOS

Uses low power consumption and offers high noise immunity, ensuring reliable operation in different scenarios.

Technical Specifications

Multiplexer & Demultiplexer 74LVC1G157GF,132 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74LVC1G157GF,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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