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CD40257BF

Texas Instruments

CD40257BF by Texas Instruments

CD40257BF by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at supply voltages from 3V to 18V. It features a propagation delay of 300ns and supports true output polarity with 3-state characteristics. Ideal for military-grade applications requiring high-temperature resistance up to 125°C.

Median Price

$1.290

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

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-

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$1.290

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$1.160

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$1.090

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$1.090

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Digiode

USA . 3,509 parts In-Stock

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$1.368

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Freelance Electronics

USA . 7 parts In-Stock

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$3.602

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Vyrian

USA . 3,306 parts In-Stock

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LWI Electronics Inc

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ECAB

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Standard Data Resources

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Electronic Expediters

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Holdelec - ElecDif-Pro

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GES GmbH

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Bristol Electronics

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Q Components

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Native Components

USA . 722 parts In-Stock

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$0.387

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$0.372

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Northwest PG Solutions

USA . 1,949 parts In-Stock

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$0.426

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$0.375

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Corphita

USA . 4,099 parts In-Stock

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$1.296

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Parana Technologies

USA . 944 parts In-Stock

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$8.478

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$9.131

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DigiPath Technology Company

USA . 1,161 parts In-Stock

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$9.335

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$8.589

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ChromeModa Solutions

Germany . 5,701 parts In-Stock

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$9.526

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$7.811

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IDEA Electronic Components Group

UK . 577 parts In-Stock

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$9.526

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$9.050

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$8.573

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Supply Digital

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Kepictronics

USA . 330 parts In-Stock

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A-Plus Industry Inc.

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Overview

Experience the reliability and precision of Texas Instruments with the CD40257BF multiplexer & demultiplexer. This versatile component offers seamless integration into a variety of applications, providing customers with unparalleled value and performance. From its durable ceramic, glass-sealed package body to its 3-STATE output characteristics, this product is designed to exceed expectations. Trust in Texas Instruments for quality solutions that deliver results.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed materials provide durability and protection, making this product suitable for harsh environments.

No. of Functions: 4

Having 4 functions in one device allows for efficient multiplexing and demultiplexing operations in a single component.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with common power sources and reduces the need for additional voltage regulation.

Propagation Delay (tpd): 300 ns

Low propagation delay ensures fast data transmission and response times in multiplexing and demultiplexing applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without performance degradation.

Output Characteristics: 3-STATE

The 3-state output allows for tri-state logic, enhancing versatility and flexibility in signal routing.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliable operation in extreme temperature conditions, making it suitable for defense and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Technical Specifications

Multiplexer & Demultiplexer CD40257BF attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

CD40257BF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-120-8685, 5962011208685, 5962-01-098-1473, 5962010981473, 5962-01-296-9143, 5962012969143

NIIN

011208685, 010981473, 012969143

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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