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CD40257BK

Texas Instruments

CD40257BK by Texas Instruments

CD40257BK by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at supply voltages b/w 3V to 18V. It features a propagation delay of 300ns and supports true output polarity with a temperature range from -55°C to 125°C. Ideal for military-grade applications requiring CMOS technology in a flatpack package style.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 5,681 parts In-Stock

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Digiode

USA . 3,387 parts In-Stock

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Electronic Expediters

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Sunrise Surplus Inc.

USA . 2 parts In-Stock

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AZTECH Wire

Italy . 371 parts In-Stock

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$6.052

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Parana Technologies

USA . 552 parts In-Stock

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$13.993

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DigiPath Technology Company

USA . 1,156 parts In-Stock

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$15.408

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$14.175

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ChromeModa Solutions

Germany . 3,839 parts In-Stock

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$12.892

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IDEA Electronic Components Group

UK . 514 parts In-Stock

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One Stop Electronics

USA . 374 parts In-Stock

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Northwest PG Solutions

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Corphita

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Native Components

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Supply Digital

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Overview

Upgrade your electronic projects with the CD40257BK by Texas Instruments, a top-quality multiplexer and demultiplexer that offers unmatched performance and reliability. With a durable ceramic and glass-sealed package body, this device is designed to handle even the most demanding applications. Whether you're working on industrial automation or consumer electronics, this versatile component with 3-state output characteristics provides excellent value and efficiency. Trust in Texas Instruments for cutting-edge technology and seamless integration in all your circuit designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body ensures durability and reliability for the product, making it suitable for various environments.

Surface Mount: YES

The surface mount capability allows for easier installation and space-saving on PCBs.

No. of Functions: 4

Having 4 functions in one device provides versatility and flexibility in designing circuits.

No. of Inputs: 2

With 2 inputs, this multiplexer & demultiplexer can handle multiple input signals efficiently.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and integrate into circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V makes it compatible with standard power sources.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for various inputs and outputs.

Package Style (Meter): FLATPACK

The flatpack style offers a compact and space-efficient design for easy integration.

Propagation Delay (tpd): 300 ns

The low propagation delay of 300 ns ensures fast and efficient signal processing.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C enables use in a wide range of environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance state, providing flexibility in controlling the output signals.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product can withstand harsh cold environments.

Terminal Position: DUAL

The dual terminal position offers redundancy and flexibility in connecting to external circuits.

Output Polarity: TRUE

Having true output polarity ensures accurate signal transmission and processing.

Minimum Supply Voltage (Vsup): 3 V

The capability to operate at a minimum voltage of 3V provides efficiency in power management.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliability and performance in rugged conditions.

Technology: CMOS

Using CMOS technology enables low power consumption and high-speed operation.

Terminal Form: FLAT

The flat terminal form provides easy soldering and connection to PCBs.

Maximum Supply Voltage (Vsup): 18 V

Being able to handle a maximum voltage of 18V offers flexibility in power supply options.

Technical Specifications

Multiplexer & Demultiplexer CD40257BK attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-GDFP-F16

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

CD40257BK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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