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SN74HC352N

Texas Instruments

SN74HC352N by Texas Instruments

SN74HC352N by Texas Instruments is a CMOS multiplexer/demultiplexer with 2 functions, 4 inputs, and operates b/w -40°C to 85°C. It has 16 terminals in an in-line package style suitable for industrial applications requiring dual terminal positions.

Median Price

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Lifecycle Status

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9

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Vyrian

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Digiode

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Mil-Aero Solutions, Inc.

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DF Sales Co.

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DF Sales Co.

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Inventory MP

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Bristol Electronics

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GES GmbH

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ACDS - Activité Composants Distribution Service

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One Stop Electronics

USA . 920 parts In-Stock

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AZTECH Wire

Italy . 487 parts In-Stock

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Parana Technologies

USA . 1,271 parts In-Stock

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ChromeModa Solutions

Germany . 2,404 parts In-Stock

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IDEA Electronic Components Group

UK . 2,003 parts In-Stock

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Corphita

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DigiPath Technology Company

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Cyclops Electronics Ltd (Excess)

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Overview

The Texas Instruments SN74HC352N is a versatile multiplexer and demultiplexer that offers high-quality performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product ensures superior functionality and durability. Ideal for a wide range of applications, the SN74HC352N provides customers with enhanced efficiency and flexibility in their projects. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Choose the SN74HC352N for unbeatable value, benefits, and advantages in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the internal components of the multiplexer/demultiplexer, ensuring reliable performance over time.

No. of Functions: 2

Having 2 functions in a single device allows for efficient signal routing and management, making it versatile for various applications.

No. of Inputs: 4

With 4 inputs, this multiplexer/demultiplexer can handle multiple input sources, increasing the flexibility and scalability of the system.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into existing systems or PCB layouts, optimizing space efficiency.

Power Supplies (V): 2/6

Supporting power supplies of 2V to 6V ensures compatibility with a wide range of systems, offering flexibility in power requirements.

No. of Terminals: 16

Having 16 terminals enables easy connections and integration with other components, simplifying the installation process.

Package Style (Meter): IN-LINE

The in-line package style is convenient for organized and compact placement on a PCB, facilitating a tidy and efficient circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold environments without compromising performance.

Terminal Position: DUAL

Dual terminal position enhances stability and connectivity, reducing the risk of signal loss or interference during operation.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the multiplexer/demultiplexer can withstand harsh environmental conditions typical in industrial settings, guaranteeing long-term reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliable signal processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides easy and secure soldering onto a PCB, ensuring robust and reliable connections for stable performance.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy and precise alignment during installation, promoting accurate connection and reducing the risk of errors.

Technical Specifications

Multiplexer & Demultiplexer SN74HC352N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC352N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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