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SN74CBT3257PWRG4

Texas Instruments

SN74CBT3257PWRG4 by Texas Instruments

SN74CBT3257PWRG4 by Texas Instruments is a 4-function multiplexer with 0.25 ns propagation delay at 5V. It features 3-STATE output characteristics, operates in industrial temperature range (-40 to 85 °C), and has a small outline package style. Ideal for applications requiring fast switching b/w multiple input/output signals.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 13,544 parts In-Stock

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Digiode

USA . 4,700 parts In-Stock

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Vyrian

USA . 4,411 parts In-Stock

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Bristol Electronics

USA . 2,481 parts In-Stock

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Microfarads

USA . 1,665 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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One Stop Electronics

USA . 133 parts In-Stock

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$13.000

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Corohmni

South Africa . 194 parts In-Stock

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$13.112

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AZTECH Wire

Italy . 870 parts In-Stock

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$15.421

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Parana Technologies

USA . 2,265 parts In-Stock

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$28.586

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$49.209

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Semicontronic

India . 668 parts In-Stock

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$30.000

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$29.250

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$29.100

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DigiPath Technology Company

USA . 2,350 parts In-Stock

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$31.477

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ChromeModa Solutions

Germany . 2,951 parts In-Stock

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IDEA Electronic Components Group

UK . 1,601 parts In-Stock

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$28.907

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Ampacity Inc.

Singapore . 1,276 parts In-Stock

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Continental Prestige Electronics

USA . 3,899 parts In-Stock

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Argo Parts USA

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Corphita

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Microchip USA

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Perfect Parts

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Aranea Global

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Overview

Unlock the power of seamless signal routing with the versatile SN74CBT3257PWRG4 by Texas Instruments. Designed with precision and reliability in mind, this multiplexer & demultiplexer offers unparalleled performance for a wide range of applications. With its compact design and advanced technology, this product guarantees fast signal propagation, low power consumption, and ease of integration. Trust Texas Instruments to deliver quality products that exceed expectations. Upgrade your system today with the SN74CBT3257PWRG4 and experience the difference in efficiency and functionality.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Lightweight material makes the product portable and durable.

Propagation Delay At Nominal Supply

0.25 ns - Fast propagation delay ensures efficient signal transmission.

Surface Mount

YES - Allows for easy installation on PCB boards.

No. of Functions

4 - Can handle multiple functions simultaneously, increasing efficiency.

Package Shape

RECTANGULAR - Compact size saves space in electronic devices.

Nominal Supply Voltage / Vsup (V)

5 - Compatible with standard 5V power supplies.

Load Capacitance (CL)

50 pF - Can handle a moderate load capacitance for reliable performance.

Power Supplies (V)

5 - Compatible with common power supplies.

No. of Terminals

16 - Sufficient terminals for connecting to other components.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Streamlined design for space efficiency.

Propagation Delay (tpd)

0.35 ns - Fast propagation delay ensures quick data transfer.

Maximum Operating Temperature

85 °C - Can withstand high temperatures for versatility.

Output Characteristics

3-STATE - Offers flexibility in output options.

Minimum Operating Temperature

40 °C - Can operate in extreme cold conditions.

Terminal Finish

NICKEL PALLADIUM GOLD - Corrosion-resistant finish for long-term reliability.

Terminal Position

DUAL - Dual terminal position for enhanced connectivity.

Maximum Seated Height

1.2 mm - Low profile design for compact devices.

Width

4.4 mm - Slim width for space-saving installation.

Output Polarity

TRUE - Accurate output polarity for precise signal transmission.

Minimum Supply Voltage (Vsup)

4 V - Can operate at low voltage for energy efficiency.

Maximum Time At Peak Reflow Temperature (s)

30 - Can withstand peak reflow temperatures for soldering.

Peak Reflow Temperature °C

260 - High temperature resistance for soldering processes.

Length

5 mm - Compact length for space-saving installations.

Temperature Grade

INDUSTRIAL - Suitable for industrial environments.

Technology

CMOS - CMOS technology for efficient performance.

Terminal Form

GULL WING - Gull wing terminal form for easy soldering.

Packing Method

TR - TR packing method for easy storage and transportation.

Terminal Pitch

0.65 mm - Small terminal pitch for compact design.

Maximum Supply Voltage (Vsup)

5.5 V - Can handle higher supply voltages for versatile applications.

Maximum Power Supply Current (ICC)

0.003 mA - Low power consumption for energy efficiency.

No. of Outputs

2 - Provides multiple output options for flexibility.

Technical Specifications

Multiplexer & Demultiplexer SN74CBT3257PWRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE MUX/DMUX SWITCH

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.003 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74CBT3257PWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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