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SNC54LS399J

Texas Instruments

SNC54LS399J by Texas Instruments

SNC54LS399J by Texas Instruments is a MIL-STD-883 Class B multiplexer with 4 functions, 2 inputs, and operates at temperatures from -55 to 125°C. It has a supply voltage of 5V and comes in an IN-LINE package style. Ideal for military-grade applications requiring TTL technology and through-hole terminals.

Median Price

$29.987

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Freelance Electronics

USA . 18 parts In-Stock

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$29.987

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$31.487

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Vyrian

USA . 8,884 parts In-Stock

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Digiode

USA . 4,482 parts In-Stock

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Sogenti Electronics

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Resion

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Electronic Expediters

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Parana Technologies

USA . 1,361 parts In-Stock

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$8.825

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$9.511

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ChromeModa Solutions

Germany . 5,798 parts In-Stock

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$9.916

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$8.131

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IDEA Electronic Components Group

UK . 1,446 parts In-Stock

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$9.916

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$9.420

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$8.924

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AZTECH Wire

Italy . 531 parts In-Stock

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One Stop Electronics

USA . 1,294 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 1,508 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the SNC54LS399J by Texas Instruments, a leading manufacturer in the electronics industry. This versatile multiplexer & demultiplexer offers exceptional performance for a wide range of applications. With its MIL-STD-883 Class B screening level and military-grade temperature grade, this product ensures durability and precision. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Choose the SNC54LS399J for unmatched value and benefits in your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide better thermal conductivity and mechanical durability, making the product suitable for high-temperature and rugged environments.

No. of Functions: 4

Having 4 functions allows for efficient multiplexing and demultiplexing of signals, providing versatility and flexibility in managing data streams.

Screening Level: MIL-STD-883 Class B (Modified)

Adhering to MIL-STD-883 Class B standards ensures high reliability and quality, making the product suitable for critical applications in military and aerospace industries.

No. of Inputs: 2

With 2 inputs, the multiplexer/demultiplexer can handle multiple input signals, allowing for data aggregation and distribution effectively.

Nominal Supply Voltage / Vsup (V): 5

Operating at 5V supply voltage provides compatibility with standard TTL logic levels and ensures consistent performance in various electronic systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to function reliably in harsh temperature conditions, extending its usability in demanding environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical connections and are suitable for applications that require durability and stability in challenging conditions.

Technical Specifications

Multiplexer & Demultiplexer SNC54LS399J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54LS399J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-070-8433, 5962010708433

NIIN

010708433

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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