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SNC54152AW

Texas Instruments

SNC54152AW by Texas Instruments

The Texas Instruments SNC54152AW is a ceramic multiplexer with 8 inputs, MIL-STD-883 Class B screening, and TTL technology. It operates b/w -55°C to 125°C, suitable for military applications requiring high reliability in harsh environments. The flatpack package with 14 terminals and dual position is ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,792 parts In-Stock

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4,792

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Digiode

USA . 4,118 parts In-Stock

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4,118

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Distributors (Availability)

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AZTECH Wire

Italy . 602 parts In-Stock

1+ parts

$5.494

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602

$5.494

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Parana Technologies

USA . 2,290 parts In-Stock

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$19.023

100+ parts

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1k+ parts

$19.080

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2,290

$19.023

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$19.080

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DigiPath Technology Company

USA . 1,825 parts In-Stock

1+ parts

$20.947

100+ parts

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1,825

$20.947

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ChromeModa Solutions

Germany . 2,449 parts In-Stock

1+ parts

$21.374

100+ parts

$17.527

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2,449

$21.374

$17.527

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IDEA Electronic Components Group

UK . 833 parts In-Stock

1+ parts

$21.374

100+ parts

$20.305

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$19.237

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833

$21.374

$20.305

$19.237

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One Stop Electronics

USA . 1,061 parts In-Stock

1+ parts

$37.000

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1,061

$37.000

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Corphita

USA . 928 parts In-Stock

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928

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Overview

Upgrade your electronic projects with the high-quality SNC54152AW by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments offers top-notch products like this Multiplexer & Demultiplexer, ideal for a wide range of applications. With its MILITARY-grade technology and durable CERAMIC package body material, this product ensures reliability and performance. Don't miss out on the value and benefits that this versatile component brings to your projects. Experience the advantages firsthand and take your electronics to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and mechanical stability, making it suitable for high temperature environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on printed circuit boards, saving space and reducing assembly time.

Screening Level: MIL-STD-883 Class B (Modified)

This screening level ensures high reliability and quality standards, making the product suitable for military and aerospace applications.

No. of Inputs: 8

Having 8 inputs allows for versatile signal routing and selection, offering flexibility in system design.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient utilization of space on PCBs and enhances ease of integration in electronic systems.

No. of Terminals: 14

With 14 terminals, the multiplexer/demultiplexer can accommodate multiple connections, enabling complex signal processing tasks.

Package Style (Meter): FLATPACK

Flatpack style offers a compact and low profile package design, suitable for applications with space constraints.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in cold environments without compromising functionality.

Terminal Position: DUAL

Dual terminal position facilitates easy connections and enhances signal routing capabilities for the device.

Temperature Grade: MILITARY

Military grade temperature rating ensures the device can withstand extreme temperature variations and harsh operating conditions.

Technology: TTL

TTL technology offers high-speed signal processing capabilities, suitable for applications requiring fast data transmission.

Terminal Form: FLAT

Flat terminal form simplifies the soldering process during assembly and creates a secure connection with the PCB.

Terminal Pitch: 1.27 mm

Small terminal pitch allows for dense packing of terminals on the device, enabling efficient use of board space.

Technical Specifications

Multiplexer & Demultiplexer SNC54152AW attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F14

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC54152AW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-242-2721, 5962002422721

NIIN

002422721

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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