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SN74HC153N

Texas Instruments

SN74HC153N by Texas Instruments

SN74HC153N by Texas Instruments is a CMOS multiplexer/demultiplexer with 2 functions, 4 inputs, and 4 bits. It operates at a nominal voltage of 5V with a propagation delay of 38ns. Ideal for industrial applications requiring high-speed data switching in a compact package.

Median Price

$0.652

Lifecycle Status

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Chip1Stop

Japan . 485 parts In-Stock

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Farnell

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Element14

Singapore . 783 parts In-Stock

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Mouser Electronics

USA . 439 parts In-Stock

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Rochester

USA . 29,572 parts In-Stock

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DigiKey

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Avnet

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Freelance Electronics

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TEDSS.com

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Component Electronics Inc.

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TME

Poland . 340 parts In-Stock

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Ace Electronics

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Voyager Components

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DigiKey Marketplace

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A2Z Electronics, Inc.

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Continental Prestige Electronics

USA . 5,367 parts In-Stock

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Argo Parts USA

USA . 1,894 parts In-Stock

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$0.232

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Bastille Electronics

Australia . 120 parts In-Stock

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Ampacity Inc.

Singapore . 8,735 parts In-Stock

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$0.301

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Corphita

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Microchip USA

USA . 9,455 parts In-Stock

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$5.655

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Parana Technologies

USA . 453 parts In-Stock

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DigiPath Technology Company

USA . 743 parts In-Stock

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$24.702

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IDEA Electronic Components Group

UK . 2,377 parts In-Stock

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$26.028

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ChromeModa Solutions

Germany . 1,261 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments SN74HC153N Multiplexer & Demultiplexer. This high-quality component offers unmatched reliability and performance, thanks to its cutting-edge technology and superior construction. Perfect for a wide range of applications, this versatile product provides customers with exceptional value and benefits. Trust Texas Instruments to deliver top-notch solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply:

38 ns - The low propagation delay ensures fast and efficient data processing.

No. of Functions:

2 - Having 2 functions in one device provides flexibility and saves space in circuit design.

No. of Inputs:

4 - With 4 inputs, the multiplexer/demultiplexer can handle multiple data streams simultaneously.

Package Shape:

RECTANGULAR - The rectangular package shape allows for easy integration and placement on a circuit board.

No. of Bits:

4 - The 4-bit configuration enables the device to handle a wide range of data inputs and outputs.

Nominal Supply Voltage / Vsup (V):

5 - The 5V supply voltage ensures compatibility with standard power sources.

Load Capacitance (CL):

150 pF - The low load capacitance allows for efficient signal transmission without distortion.

Power Supplies (V):

2/6 - The dual power supply option provides flexibility in powering the device within different voltage ranges.

No. of Terminals:

16 - The 16 terminals offer ample connectivity options for various circuit configurations.

Package Style (Meter):

IN-LINE - The in-line package style is space-saving and easy to connect in a circuit layout.

Maximum I (ol):

7.8 Amp - The high output current capability makes the device suitable for handling large data loads.

Propagation Delay (tpd):

274 ns - The low propagation delay ensures quick data processing and minimal lag.

Maximum Operating Temperature:

85 °C - With a high operating temperature range, the device can perform reliably in various environments.

Minimum Operating Temperature:

40 °C - The device can operate efficiently even in extreme cold temperatures.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position:

DUAL - The dual terminal position offers more flexibility in circuit board layout and connection options.

Maximum Seated Height:

5.08 mm - The low profile design allows for compact integration into circuit boards.

Width:

7.62 mm - The narrow width enables space-efficient placement in circuit designs.

Output Polarity:

TRUE - The true output polarity ensures accurate signal transmission without inversion.

Minimum Supply Voltage (Vsup):

2 V - The low minimum supply voltage requirement allows for compatibility with a wide range of power sources.

Length:

19.305 mm - The moderate length of the device ensures easy integration into circuit board layouts.

Temperature Grade:

INDUSTRIAL - The industrial-grade temperature rating ensures reliable operation in harsh environmental conditions.

Technology:

CMOS - The CMOS technology used in the device provides low power consumption and high noise immunity.

Terminal Form:

THROUGH-HOLE - The through-hole terminal form allows for secure and stable connections on circuit boards.

Packing Method:

TUBE - The tube packing method provides convenient storage and transportation of the product.

Terminal Pitch:

2.54 mm - The standard terminal pitch allows for easy connection and compatibility with various components.

Maximum Supply Voltage (Vsup):

6 V - The high maximum supply voltage capability ensures compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC):

0.08 mA - The low power supply current consumption minimizes energy usage and heat generation.

Technical Specifications

Multiplexer & Demultiplexer SN74HC153N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

274 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74HC153N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-327-2424, 5962013272424

NIIN

013272424

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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