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SN74HC257D

Texas Instruments

SN74HC257D by Texas Instruments

SN74HC257D by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 25ns. Operating at a supply voltage of 5V, it features a small outline package style and industrial temperature grade suitability. Ideal for applications requiring high-speed signal switching in compact designs.

Median Price

$0.500

Lifecycle Status

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31

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1k+

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Mouser Electronics

USA . 1,841 parts In-Stock

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$0.920

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$0.367

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Rochester

USA . 5,161 parts In-Stock

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DigiKey

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Verical

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Freelance Electronics

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Digiode

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Greenchips

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Nova Conductors

Japan . 15 parts In-Stock

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Cogito LLC

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ComSIT Distribution GmbH

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Connector Distribution Corp

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Right Parts Inc.

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LWI Electronics Inc

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Bristol Electronics

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Inventory MP

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Semi Source

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Zilex Electronics Inc.

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Atlantic Semiconductor

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Mentor Electronics Marketing, LLC

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SIE Connect GmbH - GreenChips

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Resion

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Holdelec - ElecDif-Pro

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Semtec, LLC

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PC Components Company LLC

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Extreme Components

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Semicontronic

India . 2,670 parts In-Stock

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$0.282

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Ampacity Inc.

Singapore . 2,526 parts In-Stock

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Corphita

USA . 1,464 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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$0.369

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Continental Prestige Electronics

USA . 5,639 parts In-Stock

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$0.376

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Argo Parts USA

USA . 4,672 parts In-Stock

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$0.376

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$0.365

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Parana Technologies

USA . 1,627 parts In-Stock

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$15.335

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$15.728

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DigiPath Technology Company

USA . 963 parts In-Stock

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$16.885

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ChromeModa Solutions

Germany . 6,999 parts In-Stock

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IDEA Electronic Components Group

UK . 1,510 parts In-Stock

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Corohmni

South Africa . 852 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Technoshack Inc. (Excess)

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Overview

Enhance your electronic projects with the SN74HC257D multiplexer/demultiplexer by Texas Instruments. With a focus on quality and reliability, Texas Instruments is a trusted manufacturer in the industry. This versatile component offers customers the advantage of switching between multiple functions seamlessly, making it ideal for a wide range of applications. From data processing to signal routing, this product provides excellent value, efficiency, and ease of use. Upgrade your projects with the SN74HC257D and experience the benefits of superior performance and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 25 ns

Allows for quick switching between inputs, ensuring efficient data transmission.

Surface Mount: YES

Enables easy and convenient installation on circuit boards.

No. of Functions: 4

Allows for multiple functions to be performed in a single component, saving space and reducing complexity.

No. of Inputs: 2

Provides flexibility in input options for versatile applications.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs.

No. of Bits: 2

Suitable for applications requiring low to moderate data processing.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common voltage standards, making it easy to incorporate into existing systems.

Load Capacitance (CL): 150 pF

Provides stable operation by handling capacitance within specified limits.

Power Supplies (V): 2/6

Supports a range of power supply voltages for versatility in different applications.

No. of Terminals: 16

Offers ample connectivity options for various inputs and outputs.

Package Style (Meter): SMALL OUTLINE

Saves space on the circuit board, allowing for denser layouts.

Maximum I (ol): 7.8 Amp

Capable of handling high current outputs for robust performance.

Propagation Delay (tpd): 190 ns

Balances speed and performance to ensure efficient data transmission.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of temperature conditions, enhancing versatility.

Output Characteristics: 3-STATE

Allows for tri-state logic operation, offering additional flexibility in output control.

Minimum Operating Temperature: -40 °C

Capable of functioning in harsh environmental conditions with low temperatures.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures reliable electrical connections and resistance to corrosion.

Terminal Position: DUAL

Provides redundancy in terminal connections for added reliability.

Maximum Seated Height: 1.75 mm

Allows for compact packaging in space-constrained applications.

Width: 3.9 mm

Compact size enables efficient use of space on the circuit board.

Output Polarity: TRUE

Simplifies signal processing by maintaining correct polarity.

Minimum Supply Voltage (Vsup): 2 V

Can operate at low supply voltages, suitable for energy-efficient designs.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes during assembly.

Length: 9.9 mm

Compact design allows for efficient use of space in circuit layouts.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges and reliability requirements.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering onto the circuit board for reliable connections.

Packing Method: TUBE

Secure packaging method for easy handling and storage of the components.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common circuit board designs.

Maximum Supply Voltage (Vsup): 6 V

Can handle higher supply voltages for increased flexibility in power requirements.

Maximum Power Supply Current (ICC): 0.08 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Multiplexer & Demultiplexer SN74HC257D attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC257D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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