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SN74F251D3

Texas Instruments

SN74F251D3 by Texas Instruments

SN74F251D3 by Texas Instruments is an 8-input multiplexer with a propagation delay of 12.5 ns at 5V supply, featuring 3-STATE output characteristics. It operates in a temperature range of 0 to 70°C and has a max power supply current of 24 mA. Ideal for applications requiring high-speed data selection in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,060 parts In-Stock

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3,060

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Digiode

USA . 1,402 parts In-Stock

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1,402

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Distributors (Availability)

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One Stop Electronics

USA . 467 parts In-Stock

1+ parts

$9.000

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467

$9.000

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AZTECH Wire

Italy . 501 parts In-Stock

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$12.823

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501

$12.823

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Parana Technologies

USA . 531 parts In-Stock

1+ parts

$13.583

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$14.086

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531

$13.583

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$14.086

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DigiPath Technology Company

USA . 2,044 parts In-Stock

1+ parts

$14.957

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$13.760

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2,044

$14.957

$13.760

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ChromeModa Solutions

Germany . 6,790 parts In-Stock

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$15.262

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$12.515

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6,790

$15.262

$12.515

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

1+ parts

$15.262

100+ parts

$14.499

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$13.736

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2,033

$15.262

$14.499

$13.736

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Corphita

USA . 1,832 parts In-Stock

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1,832

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Overview

Enhance your electronic projects with the SN74F251D3 by Texas Instruments, a top-quality Multiplexer & Demultiplexer that offers unrivaled performance and reliability. Designed by a trusted manufacturer known for innovation and excellence, this versatile component boasts 8 inputs, a fast propagation delay of 12.5 ns, and low power consumption. Whether you're working on circuit design, data processing, or signal routing, this small outline package with gull wing terminals will streamline your workflow and deliver outstanding results. Upgrade your projects today with the SN74F251D3 and experience the value and benefits it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 12.5 ns

Low propagation delay ensures fast data processing and transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and enabling mass production.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer can handle multiple data streams simultaneously, enhancing its versatility.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes integration with other components simple and efficient.

Power Supplies (V): 5

Consistent power supply ensures stable operation and reliable performance of the multiplexer/demultiplexer.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and configurations, offering flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The compact small outline package saves space on the PCB, ideal for applications with limited board real estate.

Maximum I (ol): 24 Amp

High output current capability enables driving of heavy loads, expanding the range of devices that can be connected.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand typical industrial environments without overheating.

Output Characteristics: 3-STATE

3-state outputs allow for high impedance state, useful for connecting multiple devices without interference.

Minimum Operating Temperature: 0 °C

The ability to operate at as low as 0°C ensures functionality in a wide range of temperatures, including cold environments.

Terminal Position: DUAL

Dual terminal position accommodates different mounting orientations, offering flexibility in circuit board layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for typical commercial applications, providing reliable performance in standard operating conditions.

Technology: TTL

TTL technology offers fast switching speeds and compatibility with a wide range of digital devices, making this product versatile and widely applicable.

Terminal Form: GULL WING

Gull wing terminal form simplifies surface mounting process and enhances solder joint reliability, contributing to overall product durability.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm enables easy integration with other components on the PCB, facilitating efficient assembly.

Maximum Power Supply Current (ICC): 24 mA

With a maximum current draw of 24mA, this multiplexer/demultiplexer operates with low power consumption, suitable for energy-efficient designs.

Technical Specifications

Multiplexer & Demultiplexer SN74F251D3 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay At Nominal Supply:

12.5 ns

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74F251D3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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