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SN74S253N1

Texas Instruments

SN74S253N1 by Texas Instruments

SN74S253N1 by Texas Instruments is a TTL technology-based 2:4 multiplexer/demultiplexer with 16 terminals. It operates at temperatures b/w 0°C to 70°C, with a supply voltage of 5V. This rectangular package is ideal for commercial applications requiring dual terminal positions and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,961 parts In-Stock

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5,961

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Digiode

USA . 964 parts In-Stock

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964

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Distributors (Availability)

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AZTECH Wire

Italy . 256 parts In-Stock

1+ parts

$6.076

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256

$6.076

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Parana Technologies

USA . 264 parts In-Stock

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$28.018

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$42.809

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264

$28.018

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$42.809

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DigiPath Technology Company

USA . 1,769 parts In-Stock

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$30.851

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$28.383

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1,769

$30.851

$28.383

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ChromeModa Solutions

Germany . 2,510 parts In-Stock

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$31.481

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$25.814

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2,510

$31.481

$25.814

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IDEA Electronic Components Group

UK . 653 parts In-Stock

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$31.481

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$29.907

1k+ parts

$28.333

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653

$31.481

$29.907

$28.333

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One Stop Electronics

USA . 896 parts In-Stock

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$43.000

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$43.000

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Corphita

USA . 3,805 parts In-Stock

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3,805

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Overview

Upgrade your electronics projects with the SN74S253N1 by Texas Instruments, a top-quality multiplexer & demultiplexer that offers unmatched performance and reliability. With its innovative design and advanced technology, this product is perfect for a wide range of applications. From data processing to signal routing, this versatile component ensures seamless operation and optimal efficiency. Trust Texas Instruments, a renowned manufacturer known for delivering cutting-edge solutions in the industry. Maximize your projects with the SN74S253N1 and experience the value, benefits, and advantages it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring a longer lifespan.

No. of Functions: 2

Having 2 functions allows for versatile use of the device, making it suitable for various applications where multiple functions are required.

No. of Inputs: 4

With 4 inputs, this multiplexer/demultiplexer can handle a larger amount of data input, making it suitable for complex data processing tasks.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power supplies and ensures efficient performance.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity and integration with other components in a circuit, making installation and setup convenient.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this device can withstand high temperatures and operate reliably even in demanding environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for efficient data transmission and processing.

Technology: TTL

Using TTL technology ensures high-speed data processing and reliable performance, making this multiplexer/demultiplexer a suitable choice for applications requiring fast data handling.

Technical Specifications

Multiplexer & Demultiplexer SN74S253N1 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74S253N1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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