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SN74HC253DBRE4

Texas Instruments

SN74HC253DBRE4 by Texas Instruments

SN74HC253DBRE4 by Texas Instruments is a dual 4-input multiplexer with a propagation delay of 38ns. It operates at a nominal voltage of 5V and has a max operating temperature of 85°C. Ideal for industrial applications requiring high-speed signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,389 parts In-Stock

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6,389

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Digiode

USA . 3,862 parts In-Stock

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3,862

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Distributors (Availability)

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AZTECH Wire

Italy . 881 parts In-Stock

1+ parts

$6.444

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881

$6.444

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Parana Technologies

USA . 1,505 parts In-Stock

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$22.037

100+ parts

-

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$22.594

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1,505

$22.037

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$22.594

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DigiPath Technology Company

USA . 1,265 parts In-Stock

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$24.266

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1,265

$24.266

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ChromeModa Solutions

Germany . 5,875 parts In-Stock

1+ parts

$24.761

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$20.304

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5,875

$24.761

$20.304

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IDEA Electronic Components Group

UK . 2,211 parts In-Stock

1+ parts

$24.761

100+ parts

$23.523

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$22.285

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2,211

$24.761

$23.523

$22.285

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One Stop Electronics

USA . 1,023 parts In-Stock

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$43.000

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1,023

$43.000

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Corphita

USA . 4,120 parts In-Stock

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Overview

Unlock the power of versatile signal routing with the SN74HC253DBRE4 by Texas Instruments. This high-quality multiplexer & demultiplexer offers seamless integration and reliable performance in a compact package. From data transmission to signal processing, this innovative component ensures efficient operation and enhanced functionality for your electronics projects. Trust in Texas Instruments' reputation for excellence and experience the value of superior design and precision engineering with the SN74HC253DBRE4. Elevate your creations with this essential component today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body is durable and lightweight, making the product easy to handle and transport.

Propagation Delay At Nominal Supply: 38 ns

The low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on printed circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having two functions in one device increases versatility and functionality, making it a cost-effective choice for multiplexing and demultiplexing applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is commonly used in electronic circuits, ensuring compatibility with a wide range of systems.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Technical Specifications

Multiplexer & Demultiplexer SN74HC253DBRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

275 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74HC253DBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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