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SN74HC158N-00

Texas Instruments

SN74HC158N-00 by Texas Instruments

SN74HC158N-00 by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It operates at a supply voltage range of 2V to 6V, with a propagation delay of 52ns. Ideal for industrial applications requiring inverted output polarity in an inline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,311 parts In-Stock

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Digiode

USA . 2,132 parts In-Stock

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2,132

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Distributors (Availability)

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AZTECH Wire

Italy . 712 parts In-Stock

1+ parts

$14.295

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712

$14.295

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Parana Technologies

USA . 1,415 parts In-Stock

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$18.343

100+ parts

$1,703.416

1k+ parts

$16.509

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1,415

$18.343

$1,703.416

$16.509

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DigiPath Technology Company

USA . 2,266 parts In-Stock

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$20.198

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2,266

$20.198

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ChromeModa Solutions

Germany . 4,370 parts In-Stock

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$20.610

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$16.900

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4,370

$20.610

$16.900

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IDEA Electronic Components Group

UK . 1,239 parts In-Stock

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$20.610

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$19.580

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$18.549

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1,239

$20.610

$19.580

$18.549

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One Stop Electronics

USA . 659 parts In-Stock

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$28.000

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659

$28.000

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Corphita

USA . 1,679 parts In-Stock

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Overview

Enhance your electronic projects with the SN74HC158N-00 by Texas Instruments. This high-quality multiplexer & demultiplexer offers unparalleled performance and reliability, thanks to its manufacturer's trusted reputation. Perfect for applications requiring multiple functions and inputs, this product provides exceptional value, benefits, and advantages to customers seeking a versatile solution for their projects. Upgrade your designs with Texas Instruments' top-of-the-line technology and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product, making it suitable for various industrial applications.

No. of Functions: 4

Having 4 functions in one device increases efficiency and saves space on the circuit board.

No. of Inputs: 2

With 2 inputs, the multiplexer can handle multiple signals effectively, providing flexibility in signal routing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems and power sources.

Propagation Delay (tpd): 52 ns

Low propagation delay ensures fast signal processing, making this multiplexer ideal for applications requiring quick response times.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this multiplexer can withstand high-temperature environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation of the multiplexer.

Technical Specifications

Multiplexer & Demultiplexer SN74HC158N-00 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

52 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74HC158N-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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