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SN74AS253JP4

Texas Instruments

SN74AS253JP4 by Texas Instruments

SN74AS253JP4 by Texas Instruments is a TTL technology multiplexer with 2 functions, 4 inputs, and 16 terminals. It has a propagation delay of 14 ns and can handle a max I (ol) of 24 Amp. This IC is commonly used in commercial applications requiring high-speed signal switching.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,414 parts In-Stock

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7,414

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Digiode

USA . 217 parts In-Stock

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217

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Distributors (Availability)

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AZTECH Wire

Italy . 556 parts In-Stock

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$7.189

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556

$7.189

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Parana Technologies

USA . 110 parts In-Stock

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$24.099

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$24.750

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110

$24.099

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$24.750

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DigiPath Technology Company

USA . 1,698 parts In-Stock

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$26.535

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$24.413

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$26.535

$24.413

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ChromeModa Solutions

Germany . 2,098 parts In-Stock

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$27.077

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$22.203

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$27.077

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IDEA Electronic Components Group

UK . 1,242 parts In-Stock

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$27.077

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$25.723

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$24.369

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1,242

$27.077

$25.723

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One Stop Electronics

USA . 522 parts In-Stock

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$52.000

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Corphita

USA . 581 parts In-Stock

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Overview

Enhance your electronic projects with the SN74AS253JP4 by Texas Instruments. This high-quality multiplexer & demultiplexer offers reliable performance and efficiency, thanks to its advanced technology and commercial-grade temperature tolerance. With 2 functions and 4 inputs, this versatile component is perfect for a wide range of applications. From signal routing to data selection, this Texas Instruments product provides value and benefits that will take your designs to the next level. Trust in the expertise of Texas Instruments and elevate your projects with the SN74AS253JP4.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and excellent resistance to heat, making it suitable for applications where temperature control is important.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures fast switching between inputs, leading to efficient data transmission.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, saving space and cost in circuit design.

No. of Inputs: 4

More inputs allow for greater versatility and flexibility in signal routing and processing.

Package Shape: RECTANGULAR

Rectangular shape is easy to incorporate into circuit layouts and offers efficient use of space.

No. of Terminals: 16

Having more terminals provides more connection points for input and output signals, enhancing connectivity options.

Package Style (Meter): IN-LINE

In-line package style offers a compact design that is easy to integrate into circuit boards, minimizing footprint.

Maximum I (ol): 24 Amp

High output current capability allows for driving loads with higher power requirements, expanding the range of applications.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliability and performance in varying environmental conditions.

Output Characteristics: 3-STATE

3-state output allows the device to assume one of three output states, providing greater flexibility in controlling signal flow.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the device can function reliably in cooler environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity, reducing the risk of connectivity issues.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring performance and reliability in standard operating conditions.

Technology: TTL

TTL technology offers fast response times and high noise immunity, making it ideal for high-speed data applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and mechanical strength, suitable for applications where reliability is crucial.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows easy integration into existing circuit board layouts and facilitates soldering.

Maximum Power Supply Current (ICC): 14 mA

Low power supply current requirement helps in minimizing power consumption and reduces heat dissipation.

Technical Specifications

Multiplexer & Demultiplexer SN74AS253JP4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

14 mA

Propagation Delay At Nominal Supply:

14 ns

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74AS253JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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