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CD74HCT153MTE4

Texas Instruments

CD74HCT153MTE4 by Texas Instruments

CD74HCT153MTE4 by Texas Instruments is a 2-function, 4-input multiplexer with a propagation delay of 51ns at 5V. It features a small outline package style and operates in temperatures ranging from -55 to 125°C. Ideal for military-grade applications requiring fast signal switching within tight space constraints.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,784 parts In-Stock

1+ parts

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6,784

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Digiode

USA . 1,674 parts In-Stock

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1,674

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 35 parts In-Stock

1+ parts

$9.066

100+ parts

-

1k+ parts

$9.725

10k+ parts

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35

$9.066

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$9.725

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DigiPath Technology Company

USA . 2,172 parts In-Stock

1+ parts

$9.982

100+ parts

$9.184

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2,172

$9.982

$9.184

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IDEA Electronic Components Group

UK . 1,501 parts In-Stock

1+ parts

$10.186

100+ parts

$9.677

1k+ parts

$9.167

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-

1,501

$10.186

$9.677

$9.167

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ChromeModa Solutions

Germany . 506 parts In-Stock

1+ parts

$10.186

100+ parts

$8.353

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-

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506

$10.186

$8.353

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Ampacity Inc.

Singapore . 884 parts In-Stock

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$14.000

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884

$14.000

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AZTECH Wire

Italy . 747 parts In-Stock

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$15.142

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747

$15.142

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One Stop Electronics

USA . 309 parts In-Stock

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$39.000

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309

$39.000

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Corphita

USA . 4,759 parts In-Stock

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4,759

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience superior performance and reliability with the CD74HCT153MTE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality multiplexers and demultiplexers that provide seamless integration and efficient operation. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Trust Texas Instruments to elevate your projects with cutting-edge technology and innovative solutions. Choose the CD74HCT153MTE4 for unparalleled quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 51 ns

Low propagation delay ensures fast and efficient signal transmission, suitable for applications requiring quick data processing.

No. of Inputs: 4

Having 4 inputs allows for versatility in connecting multiple input sources, making this product versatile and adaptable to different setups.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard power sources, ensuring easy integration into existing systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable operation in various environmental conditions, making this product suitable for industrial and outdoor applications.

Technical Specifications

Multiplexer & Demultiplexer CD74HCT153MTE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

51 ns

Propagation Delay (tpd):

51 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HCT153MTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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