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MC100E158FNG

Onsemi

MC100E158FNG by Onsemi

MC100E158FNG by Onsemi is a 5-function multiplexer with 0.55 ns propagation delay at 5V. It has 2 inputs, operates on -4.5V power supply, and uses ECL technology. Ideal for high-speed applications requiring fast signal switching in electronic circuits.

Median Price

$6.244

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,645 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

$4.670

4,645

-

$5.550

$4.960

$4.670

Verical

USA . 2,191 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

2,191

-

$6.938

$6.200

$5.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,956 parts In-Stock

1+ parts

$5.871

100+ parts

-

1k+ parts

-

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-

1,956

$5.871

-

-

-

Vyrian

USA . 6,267 parts In-Stock

1+ parts

-

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-

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-

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-

6,267

-

-

-

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R&J Components

USA . 47 parts In-Stock

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-

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47

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-

Distributors (Availability)

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Corphita

USA . 1,858 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

-

10k+ parts

-

1,858

$5.562

-

-

-

Corohmni

South Africa . 196 parts In-Stock

1+ parts

$6.180

100+ parts

-

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-

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-

196

$6.180

-

-

-

AZTECH Wire

Italy . 880 parts In-Stock

1+ parts

$15.940

100+ parts

-

1k+ parts

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880

$15.940

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 13,591 parts In-Stock

1+ parts

-

100+ parts

-

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13,591

-

-

-

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TANS Electronics

Latvia . 6,062 parts In-Stock

1+ parts

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6,062

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Continental Prestige Electronics

USA . 4,645 parts In-Stock

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4,645

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SupplyDigital Components

Austria . 2,109 parts In-Stock

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2,109

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UHIMA Technologies

Türkiye . 767 parts In-Stock

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767

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Kulean Microsystems

USA . 678 parts In-Stock

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678

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Problanco Electronics

Mexico . 262 parts In-Stock

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262

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Microchip USA

USA . 224 parts In-Stock

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224

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Perfect Parts

USA . 8 parts In-Stock

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8

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Overview

Enhance your electronic designs with the MC100E158FNG multiplexer/demultiplexer by Onsemi. With a reputation for top-quality products, Onsemi delivers reliability and performance that customers can trust. This versatile chip carrier is perfect for a wide range of applications, offering fast propagation delay and multiple functions in a compact package. Experience the value and benefits of Onsemi's innovative technology with the MC100E158FNG - the perfect solution for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 0.55 ns

The low propagation delay at nominal supply ensures fast and efficient signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and improving reliability.

No. of Functions: 5

With 5 functions in one device, this multiplexer & demultiplexer offers versatility and flexibility in signal routing and processing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems and power sources.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product can function reliably in a wide range of environmental conditions.

Maximum Supply Voltage (Vsup): 5.7 V

The maximum supply voltage of 5.7V provides a safety margin for overvoltage protection and ensures the device's longevity.

Technical Specifications

Multiplexer & Demultiplexer MC100E158FNG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

5

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

46 mA

Propagation Delay At Nominal Supply:

.55 ns

Propagation Delay (tpd):

.65 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E158FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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