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74ACT11257DBR

Texas Instruments

74ACT11257DBR by Texas Instruments

74ACT11257DBR by Texas Instruments is a CMOS multiplexer with 4 functions, 2 inputs, and 8.7 ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package for surface mount applications.

Median Price

$1.363

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.090

10k+ parts

$1.020

4,000

-

$1.220

$1.090

$1.020

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.400

10k+ parts

-

4,000

-

-

$1.400

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.363

10k+ parts

$1.275

2,000

-

-

$1.363

$1.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,963 parts In-Stock

1+ parts

$1.282

100+ parts

-

1k+ parts

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1,963

$1.282

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Vyrian

USA . 3,674 parts In-Stock

1+ parts

$1.350

100+ parts

-

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10k+ parts

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3,674

$1.350

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DigiKey Marketplace

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

-

10k+ parts

-

4,000

-

$1.410

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,281 parts In-Stock

1+ parts

$1.215

100+ parts

-

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3,281

$1.215

-

-

-

Parana Technologies

USA . 871 parts In-Stock

1+ parts

$19.797

100+ parts

-

1k+ parts

$19.761

10k+ parts

-

871

$19.797

-

$19.761

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DigiPath Technology Company

USA . 1,629 parts In-Stock

1+ parts

$21.799

100+ parts

$20.055

1k+ parts

-

10k+ parts

-

1,629

$21.799

$20.055

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IDEA Electronic Components Group

UK . 955 parts In-Stock

1+ parts

$22.244

100+ parts

$21.132

1k+ parts

$20.020

10k+ parts

-

955

$22.244

$21.132

$20.020

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ChromeModa Solutions

Germany . 493 parts In-Stock

1+ parts

$22.244

100+ parts

$18.240

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493

$22.244

$18.240

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Perfect Parts

USA . 3,994 parts In-Stock

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3,994

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Northwest PG Solutions

USA . 1,675 parts In-Stock

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Native Components

USA . 834 parts In-Stock

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834

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Microchip USA

USA . 487 parts In-Stock

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487

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Overview

Experience unparalleled performance and reliability with the Texas Instruments 74ACT11257DBR multiplexer & demultiplexer. Crafted with precision using top-tier materials, this product offers fast propagation delay, versatile input/output functions, and a compact design for seamless integration. Ideal for industrial applications, this component ensures optimal signal routing and efficient data handling. Elevate your projects with the unmatched quality and value of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply : 8.7 ns

Low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Surface Mount : YES

Surface mount capability allows for easy installation and integration into circuit boards, saving time and effort during assembly.

No. of Functions : 4

Having multiple functions in a single device adds versatility and flexibility to the product, enabling it to handle different tasks efficiently.

Nominal Supply Voltage / Vsup (V) : 5

Operating at a standard supply voltage of 5V makes the product compatible with a wide range of electronic systems and components.

Load Capacitance (CL) : 50 pF

A low load capacitance ensures minimal signal distortion and interference, maintaining the integrity of data transmission.

Maximum I (ol) : 24 Amp

High output current capability allows the product to drive multiple loads or devices without the risk of overload or damage.

Maximum Operating Temperature : 85 °C

The high operating temperature range makes the product suitable for use in various industrial environments without the risk of overheating or malfunction.

Technology : CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Technical Specifications

Multiplexer & Demultiplexer 74ACT11257DBR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

CENTER VCC/GND PINS

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.7 ns

Propagation Delay (tpd):

8.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74ACT11257DBR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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