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SN54AS253FK

Texas Instruments

SN54AS253FK by Texas Instruments

SN54AS253FK by Texas Instruments is a TTL technology multiplexer with 2 functions, 4 inputs, and 20 terminals. It has a propagation delay of 18ns, operates b/w -55 to 125°C, and supports a max power supply current of 14mA. Ideal for military-grade applications requiring high-speed signal switching in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,059 parts In-Stock

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3,059

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Digiode

USA . 220 parts In-Stock

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220

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Distributors (Availability)

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AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$14.772

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638

$14.772

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One Stop Electronics

USA . 812 parts In-Stock

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$16.000

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812

$16.000

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Parana Technologies

USA . 235 parts In-Stock

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$19.514

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$19.520

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235

$19.514

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$19.520

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DigiPath Technology Company

USA . 2,175 parts In-Stock

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$21.487

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2,175

$21.487

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

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$21.926

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$20.830

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$19.733

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1,720

$21.926

$20.830

$19.733

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ChromeModa Solutions

Germany . 1,349 parts In-Stock

1+ parts

$21.926

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$17.979

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1,349

$21.926

$17.979

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Corphita

USA . 396 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the SN54AS253FK by Texas Instruments, a leading manufacturer in the industry. As a versatile Multiplexer & Demultiplexer, this product offers 2 functions with 4 inputs for optimal performance. With a fast propagation delay of 18 ns and a maximum operating temperature of 125°C, this chip carrier package is perfect for military-grade applications. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Unlock endless possibilities with the SN54AS253FK.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic provides excellent thermal stability and ensures durability, making the product suitable for harsh environmental conditions.

Propagation Delay At Nominal Supply: 18 ns

The low propagation delay ensures quick processing of signals, making the product efficient for high-speed data transmission.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single device increases efficiency and simplifies circuit design.

No. of Inputs: 4

Multiple inputs allow for versatile signal routing and control, making the product suitable for various applications.

Package Shape: SQUARE

Square shape facilitates easy placement and alignment on circuit boards, enhancing overall design aesthetics and functionality.

No. of Terminals: 20

Having a sufficient number of terminals enables versatile connectivity options, making the product flexible for different circuit configurations.

Package Style (Meter): CHIP CARRIER

Chip carrier style provides compact and efficient packaging, enhancing portability and integration of the product.

Maximum I (ol): 12 Amp

High maximum output current capacity ensures reliable and stable operation, making the product suitable for demanding applications.

Maximum Operating Temperature: 125 °C

Wide temperature range allows for operation in extreme conditions, enhancing the product's reliability and durability.

Output Characteristics: 3-STATE

3-STATE output feature provides additional flexibility in signal control and routing, making the product versatile for different scenarios.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures reliable operation even in low-temperature environments, making the product suitable for various applications.

Terminal Position: QUAD

Quad terminal position simplifies connectivity and integration, enhancing ease of use and installation of the product.

Temperature Grade: MILITARY

Military-grade temperature rating ensures ruggedness and reliability, making the product suitable for demanding military and industrial applications.

Technology: TTL

TTL technology ensures high-speed data processing and compatibility with a wide range of digital systems, making the product versatile for different applications.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of soldering defects and ensures a more reliable connection, enhancing the overall performance and durability of the product.

Terminal Pitch: 1.27 mm

Optimal terminal pitch provides a balance between connectivity and space-saving, making the product suitable for compact and efficient circuit designs.

Maximum Power Supply Current (ICC): 14 mA

Low power supply current ensures energy efficiency and minimal power consumption, making the product cost-effective and environmentally friendly.

Technical Specifications

Multiplexer & Demultiplexer SN54AS253FK attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Power Supply Current (ICC):

14 mA

Propagation Delay At Nominal Supply:

18 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54AS253FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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