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CD54ACT158H

Texas Instruments

CD54ACT158H by Texas Instruments

CD54ACT158H by Texas Instruments is a CMOS multiplexer with 4 functions, 2 inputs, and inverted output polarity. It operates b/w -55 to 125°C, with a propagation delay of 9.2 ns at Vsup of 5V. Ideal for military-grade applications requiring high-speed signal switching in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,437 parts In-Stock

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Digiode

USA . 3,272 parts In-Stock

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AZTECH Wire

Italy . 397 parts In-Stock

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$13.309

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Parana Technologies

USA . 1,444 parts In-Stock

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$26.111

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$26.697

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ChromeModa Solutions

Germany . 3,450 parts In-Stock

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$29.338

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$24.057

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IDEA Electronic Components Group

UK . 1,037 parts In-Stock

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$27.871

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$26.404

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One Stop Electronics

USA . 291 parts In-Stock

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$58.000

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Corphita

USA . 2,347 parts In-Stock

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DigiPath Technology Company

USA . 1,019 parts In-Stock

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Northwest PG Solutions

USA . 503 parts In-Stock

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Native Components

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Overview

Looking for a versatile and reliable multiplexer/demultiplexer? Look no further than the Texas Instruments CD54ACT158H. With 4 functions, 2 inputs, and a fast propagation delay of 9.2 ns, this high-quality chip is perfect for a range of applications. From military-grade projects to commercial ventures, the CD54ACT158H offers unmatched performance and precision. Trust in Texas Instruments' reputation for excellence and invest in a product that delivers value and reliability for all your circuit design needs.

Feature Benefit Bullets

Surface Mount: YES

Enable easy installation and compact design, ideal for space-constrained applications.

No. of Functions: 4

Offers versatility and flexibility in routing multiple signals efficiently.

No. of Inputs: 2

Allows for selective routing of two input signals to four output channels, increasing functionality.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply, ensuring ease of integration into existing systems.

Package Style (Meter): UNCASED CHIP

Compact and lightweight design for easy handling and minimal footprint in circuit boards.

Propagation Delay (tpd): 9.2 ns

Low propagation delay ensures fast signal processing and minimal latency.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, adding durability and reliability to the product.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in various conditions, enhancing versatility.

Terminal Position: UPPER

Convenient terminal placement for easy connectivity and accessibility during installation.

Output Polarity: INVERTED

Inverted output polarity can be beneficial in certain signal processing applications and configurations.

Minimum Supply Voltage (Vsup): 4.5 V

Can operate at lower supply voltage, offering flexibility in power source selection.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, ensuring ruggedness and reliability in harsh environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for efficient signal processing.

Terminal Form: NO LEAD

Lead-free terminal form complies with RoHS regulations, promoting environmental sustainability.

Maximum Supply Voltage (Vsup): 5.5 V

Operates within safe voltage limits, protecting the product and connected devices from overvoltage damage.

Technical Specifications

Multiplexer & Demultiplexer CD54ACT158H attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

X-XUUC-N

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

UNCASED CHIP

Propagation Delay (tpd):

9.2 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

CD54ACT158H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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