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CD54ACT157H

Texas Instruments

CD54ACT157H by Texas Instruments

CD54ACT157H by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It operates b/w -55 to 125°C, with a propagation delay of 9.5 ns at Vsup of 5V. Ideal for military-grade applications requiring high-speed signal switching in compact surface-mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,557 parts In-Stock

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Digiode

USA . 918 parts In-Stock

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Parana Technologies

USA . 846 parts In-Stock

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$15.417

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$15.797

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846

$15.417

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$15.797

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AZTECH Wire

Italy . 856 parts In-Stock

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$15.886

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DigiPath Technology Company

USA . 496 parts In-Stock

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$16.976

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$15.618

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ChromeModa Solutions

Germany . 5,895 parts In-Stock

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$17.322

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$14.204

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IDEA Electronic Components Group

UK . 458 parts In-Stock

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$17.322

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$16.456

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$15.590

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Native Components

USA . 391 parts In-Stock

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$18.014

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Northwest PG Solutions

USA . 118 parts In-Stock

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$19.815

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$17.834

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One Stop Electronics

USA . 564 parts In-Stock

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$33.000

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Corphita

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD54ACT157H multiplexer/demultiplexer. With 4 functions and 2 inputs, this versatile chip offers fast propagation delay and true output polarity for seamless performance. Ideal for military-grade applications, this surface mount device operates in temperatures ranging from -55 to 125°C. Trust Texas Instruments to deliver cutting-edge technology and unparalleled value for your electronic projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and manufacturing costs.

No. of Functions: 4

Having 4 functions in one device increases functionality and saves space on the PCB, making it a versatile and compact solution.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and easy to integrate into existing circuits.

Propagation Delay (tpd): 9.5 ns

With a fast propagation delay of 9.5 ns, this multiplexer/demultiplexer ensures quick data transmission and minimal signal latency.

Maximum Operating Temperature: 125 °C

Being able to operate at temperatures as high as 125°C makes this product suitable for use in a variety of environments and applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making it a reliable choice for digital circuits.

Technical Specifications

Multiplexer & Demultiplexer CD54ACT157H attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

X-XUUC-N

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

UNCASED CHIP

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

CD54ACT157H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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