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7601601EX

Texas Instruments

7601601EX by Texas Instruments

The Texas Instruments 7601601EX is a MIL-STD-883 compliant multiplexer with 8 inputs and 16 terminals. It operates at temperatures ranging from -55 to 125 °C, with a propagation delay of 75 ns. Ideal for military applications requiring high-speed signal switching in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,358 parts In-Stock

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Vyrian

USA . 2,157 parts In-Stock

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2,157

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Distributors (Availability)

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Native Components

USA . 350 parts In-Stock

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$4.969

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350

$4.969

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AZTECH Wire

Italy . 814 parts In-Stock

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$16.466

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Parana Technologies

USA . 555 parts In-Stock

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$23.662

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$24.291

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555

$23.662

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$24.291

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DigiPath Technology Company

USA . 1,442 parts In-Stock

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$26.054

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$23.970

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$26.054

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ChromeModa Solutions

Germany . 3,262 parts In-Stock

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$26.586

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$21.801

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$26.586

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IDEA Electronic Components Group

UK . 2,280 parts In-Stock

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$26.586

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$25.257

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$23.927

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2,280

$26.586

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$23.927

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One Stop Electronics

USA . 614 parts In-Stock

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$65.000

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Corphita

USA . 4,877 parts In-Stock

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Northwest PG Solutions

USA . 1,661 parts In-Stock

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$4.870

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Overview

Elevate your electronics projects with the high-quality 7601601EX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliability and efficiency in every product. The Multiplexer & Demultiplexer category offers versatile applications for various projects. With its durable ceramic and glass-sealed body material, MIL-STD-883 screening level, and fast propagation delay of 75 ns, this product is designed to meet your needs. Experience the benefits of the 7601601EX, from its 3-STATE output characteristics to its military-grade temperature rating. Upgrade your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the internal components of the multiplexer/demultiplexer, making it suitable for various environments.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level ensures high quality and reliability of the product, making it ideal for military and aerospace applications where stringent quality standards are required.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer can handle multiple input signals efficiently, allowing for versatile signal routing and selection capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this multiplexer/demultiplexer can be easily integrated into existing systems without the need for additional power conversion circuits.

Propagation Delay (tpd): 75 ns

The low propagation delay of 75ns ensures fast signal processing, making this product suitable for applications requiring high-speed data transmission.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this multiplexer/demultiplexer can withstand high temperature environments, increasing its versatility in various industrial and military applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the outputs to be in a high-impedance state when not actively driving a signal, preventing signal interference and improving overall system performance.

Technology: BIPOLAR

Utilizing bipolar technology, this multiplexer/demultiplexer offers high switching speeds and low power consumption, making it a reliable choice for high-performance applications.

Technical Specifications

Multiplexer & Demultiplexer 7601601EX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

75 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

7601601EX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-030-7991, 5962010307991, 5962-01-271-8232, 5962012718232

NIIN

010307991, 012718232

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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