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76017012X

Texas Instruments

76017012X by Texas Instruments

The Texas Instruments 76017012X is a TTL multiplexer with 4 inputs, 2 functions, and 3-STATE output. Operating temperature range from -55 to 125 °C makes it suitable for military applications. With a propagation delay of 25 ns, this chip carrier package is ideal for high-speed signal switching.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,572 parts In-Stock

1+ parts

-

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3,572

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Digiode

USA . 2,839 parts In-Stock

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-

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-

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2,839

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 393 parts In-Stock

1+ parts

$6.060

100+ parts

-

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393

$6.060

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AZTECH Wire

Italy . 837 parts In-Stock

1+ parts

$8.487

100+ parts

-

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837

$8.487

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Parana Technologies

USA . 713 parts In-Stock

1+ parts

$20.150

100+ parts

-

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$20.095

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713

$20.150

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$20.095

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ChromeModa Solutions

Germany . 2,292 parts In-Stock

1+ parts

$22.640

100+ parts

$18.565

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-

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2,292

$22.640

$18.565

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IDEA Electronic Components Group

UK . 481 parts In-Stock

1+ parts

$22.640

100+ parts

$21.508

1k+ parts

$20.376

10k+ parts

-

481

$22.640

$21.508

$20.376

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One Stop Electronics

USA . 1,541 parts In-Stock

1+ parts

$38.000

100+ parts

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1,541

$38.000

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Corphita

USA . 3,479 parts In-Stock

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3,479

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DigiPath Technology Company

USA . 1,480 parts In-Stock

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$20.412

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1,480

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$20.412

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Northwest PG Solutions

USA . 684 parts In-Stock

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$5.939

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684

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$5.939

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Overview

Enhance your electronic designs with the 76017012X by Texas Instruments. Crafted with precision and quality, this multiplexer & demultiplexer offers unparalleled reliability and performance. Ideal for a wide range of applications, it provides seamless integration and efficiency. With its advanced technology and military-grade screening level, this product ensures optimal functionality in any environment. Experience the value and benefits of choosing Texas Instruments for your electronic component needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

No. of Functions: 2

Versatility in functionality and ability to handle multiple input signals efficiently.

Screening Level: MIL-STD-883

Ensures high quality and reliability standards for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power supply voltages, making it easy to integrate into existing systems.

No. of Inputs: 4

Ability to handle multiple input signals simultaneously, increasing flexibility in signal routing.

Package Shape: SQUARE

Compact and symmetrical design for efficient use of PCB space.

Maximum Operating Temperature: 125 °C

Can operate reliably in high-temperature environments, suitable for a wide range of applications.

Output Characteristics: 3-STATE

Ability to drive bus lines effectively, allowing for efficient signal routing and management.

Technology: TTL

Compatible with TTL logic, ensuring seamless integration with other TTL-based components.

Technical Specifications

Multiplexer & Demultiplexer 76017012X attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

25 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

8.89 mm

Trade Compliance

76017012X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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