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7601101FA

Texas Instruments

7601101FA by Texas Instruments

The Texas Instruments 7601101FA is a dual-function multiplexer with 4 inputs, 4 bits, and a propagation delay of 23 ns at 5V. It is designed for military-grade applications requiring fast signal switching in a compact flatpack package. With MIL-STD-883 screening and operating temperatures from -55°C to 125°C, it offers reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,177 parts In-Stock

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3,177

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Digiode

USA . 3,133 parts In-Stock

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3,133

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Distributors (Availability)

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Native Components

USA . 204 parts In-Stock

1+ parts

$0.331

100+ parts

-

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$0.317

204

$0.331

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$0.317

Northwest PG Solutions

USA . 127 parts In-Stock

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$0.364

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$0.321

127

$0.364

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$0.321

AZTECH Wire

Italy . 536 parts In-Stock

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$8.779

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536

$8.779

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One Stop Electronics

USA . 127 parts In-Stock

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$11.000

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127

$11.000

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Parana Technologies

USA . 1,973 parts In-Stock

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$18.533

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$18.646

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1,973

$18.533

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$18.646

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DigiPath Technology Company

USA . 251 parts In-Stock

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$20.408

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251

$20.408

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ChromeModa Solutions

Germany . 3,382 parts In-Stock

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$20.824

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$17.076

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$20.824

$17.076

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IDEA Electronic Components Group

UK . 1,549 parts In-Stock

1+ parts

$20.824

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$19.783

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$18.742

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1,549

$20.824

$19.783

$18.742

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Microchip USA

USA . 4,828 parts In-Stock

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Corphita

USA . 1,188 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the 7601101FA by Texas Instruments, a cutting-edge Multiplexer & Demultiplexer that exceeds industry standards. Perfect for military-grade applications, this product offers fast propagation delay and low power consumption, making it a top choice for critical operations. With Texas Instruments' reputation for excellence, customers can trust in the durability and performance of this versatile component. Upgrade your systems with the 7601101FA and experience the value of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 23 ns

Low propagation delay ensures fast and efficient data transmission within the multiplexer & demultiplexer.

Surface Mount: YES

Ease of installation and integration onto circuit boards, saving time and effort during assembly.

No. of Inputs: 4

Allows for multiple input signals to be processed simultaneously, increasing the versatility of the product.

Max Operating Temperature: 125 °C

Can operate in high-temperature environments, suitable for a wide range of applications.

Technology: TTL

Uses TTL technology which is known for its reliability and compatibility with various digital systems.

Technical Specifications

Multiplexer & Demultiplexer 7601101FA attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

26 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Sub-Category:

Multiplexer/Demultiplexer

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

7601101FA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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