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76011012X

Texas Instruments

76011012X by Texas Instruments

Texas Instruments 76011012X is a MIL-STD-883 compliant TTL multiplexer with 4 inputs, 2 functions, and 60ns propagation delay. Operating b/w -55 to 125 °C, it's ideal for military applications requiring a true output polarity in a ceramic chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,488 parts In-Stock

1+ parts

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6,488

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Digiode

USA . 1,595 parts In-Stock

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1,595

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 35 parts In-Stock

1+ parts

$0.511

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-

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35

$0.511

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Northwest PG Solutions

USA . 1,142 parts In-Stock

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$0.563

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$0.496

1,142

$0.563

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$0.496

AZTECH Wire

Italy . 723 parts In-Stock

1+ parts

$5.910

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723

$5.910

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One Stop Electronics

USA . 1,239 parts In-Stock

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$14.000

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1,239

$14.000

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Parana Technologies

USA . 1,912 parts In-Stock

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$20.652

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$20.763

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1,912

$20.652

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$20.763

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DigiPath Technology Company

USA . 248 parts In-Stock

1+ parts

$22.740

100+ parts

$20.921

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248

$22.740

$20.921

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ChromeModa Solutions

Germany . 3,723 parts In-Stock

1+ parts

$23.204

100+ parts

$19.027

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3,723

$23.204

$19.027

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IDEA Electronic Components Group

UK . 1,670 parts In-Stock

1+ parts

$23.204

100+ parts

$22.044

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$20.884

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1,670

$23.204

$22.044

$20.884

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Corphita

USA . 784 parts In-Stock

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784

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Overview

Enhance your electronic projects with the reliable and high-quality 76011012X multiplexer by Texas Instruments. This versatile chip carrier boasts a ceramic, metal-sealed co-fired package body material and military-grade screening level for maximum durability and performance. With 2 functions, 4 inputs, and rapid 60 ns propagation delay, this multiplexer is ideal for a wide range of applications. Trust Texas Instruments to deliver innovative solutions that exceed expectations, providing you with the value and benefits you need for success in your projects. Elevate your designs with the Texas Instruments 76011012X multiplexer today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy integration into PCBs, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in one device helps in reducing the overall component count and simplifying circuit design.

No. of Inputs: 4

With 4 inputs, this multiplexer/demultiplexer provides flexibility in routing signals or data from multiple sources.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power sources and ensures stable performance.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability in harsh environments or during extended usage.

Technology: TTL

Utilizing TTL technology ensures compatibility with various digital systems and offers fast switching speeds.

Technical Specifications

Multiplexer & Demultiplexer 76011012X attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

60 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

76011012X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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