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SN74LS354FNR

Texas Instruments

SN74LS354FNR by Texas Instruments

SN74LS354FNR by Texas Instruments is an 8-input multiplexer with a propagation delay of 45 ns. Operating at a supply voltage range of 4.75V to 5.25V, it features a package style of CHIP CARRIER and is ideal for commercial temperature grade applications requiring TTL technology.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,067 parts In-Stock

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Digiode

USA . 2,978 parts In-Stock

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2,978

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Distributors (Availability)

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AZTECH Wire

Italy . 223 parts In-Stock

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$10.871

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$10.871

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One Stop Electronics

USA . 384 parts In-Stock

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$13.000

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384

$13.000

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Parana Technologies

USA . 499 parts In-Stock

1+ parts

$19.003

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$1,764.743

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$17.103

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499

$19.003

$1,764.743

$17.103

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DigiPath Technology Company

USA . 1,660 parts In-Stock

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$20.925

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$19.251

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$20.925

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ChromeModa Solutions

Germany . 6,695 parts In-Stock

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$21.352

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$17.509

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6,695

$21.352

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IDEA Electronic Components Group

UK . 1,026 parts In-Stock

1+ parts

$21.352

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$20.284

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$19.217

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Corphita

USA . 2,064 parts In-Stock

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Overview

Unlock endless possibilities with the SN74LS354FNR from Texas Instruments. This high-quality multiplexer & demultiplexer offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. With 8 inputs and advanced 3-STATE output characteristics, this chip carrier package ensures seamless integration and efficient operation. Experience the value and benefits of Texas Instruments' cutting-edge technology in every use, from commercial to industrial settings. Upgrade your projects with the SN74LS354FNR today and elevate your results to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the multiplexer/demultiplexer.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into various circuit designs, saving space and making assembly more convenient.

No. of Inputs: 8

Having 8 inputs allows for versatile input options, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape is efficient for placement on circuit boards and ensures space-saving design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard power sources, making it easy to integrate into existing systems.

Load Capacitance (CL): 45 pF

The specified load capacitance helps in determining the maximum load that can be connected to the multiplexer/demultiplexer without affecting performance.

No. of Terminals: 20

Having 20 terminals allows for multiple connection options, enabling flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact form factor, ideal for space-constrained applications.

Propagation Delay (tpd): 45 ns

The low propagation delay ensures fast and efficient signal processing, making it suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures reliable performance even in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows for multiple output states, providing flexibility in signal routing and control.

Minimum Operating Temperature: 0 °C

Being able to operate at a minimum temperature of 0°C ensures compatibility with a wide range of operating environments.

Terminal Position: QUAD

The quad terminal position enables easy and secure connections, ensuring stable performance in various applications.

Maximum Seated Height: 4.57 mm

The maximum seated height of 4.57mm ensures compatibility with various mounting options and minimizes interference with neighboring components.

Width: 8.9662 mm

The specified width provides a compact form factor, making it suitable for applications where space is limited.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures compatibility with different logic systems, enhancing the product's versatility.

Minimum Supply Voltage (Vsup): 4.75 V

The minimum supply voltage of 4.75V ensures reliable operation even under low voltage conditions, enhancing the product's robustness.

Length: 8.9662 mm

The specified length contributes to the compact form factor of the product, making it suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures reliable operation in standard operating conditions, making it suitable for a wide range of applications.

Technology: TTL

Utilizing TTL technology ensures compatibility with existing TTL-based systems, simplifying integration and interoperability.

Terminal Form: J BEND

The J bend terminal form facilitates easy and secure connections, ensuring reliable performance in various applications.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch provides compatibility with standard spacing requirements, enabling easy integration into existing circuit designs.

Maximum Supply Voltage (Vsup): 5.25 V

Having a maximum supply voltage of 5.25V ensures safe operation within specified voltage limits, enhancing overall product reliability.

Maximum Power Supply Current (ICC): 46 mA

The specified maximum power supply current of 46mA indicates low power consumption, making it energy-efficient and cost-effective for long-term use.

Technical Specifications

Multiplexer & Demultiplexer SN74LS354FNR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

TRANSPARENT ADDRESS LATCHES

Family:

LS

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Power Supply Current (ICC):

46 mA

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

SN74LS354FNR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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