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SN74CBTLV16292DGVR

Texas Instruments

SN74CBTLV16292DGVR by Texas Instruments

SN74CBTLV16292DGVR by Texas Instruments is a 12-function multiplexer with a propagation delay of 7.1 ns, operating b/w -40 to 85 °C. It has a supply voltage range of 2.3-3.6 V and is ideal for industrial applications requiring high-speed signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,717 parts In-Stock

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Digiode

USA . 4,419 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 790 parts In-Stock

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$13.539

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790

$13.539

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Parana Technologies

USA . 1,340 parts In-Stock

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$14.565

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$15.000

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$14.565

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DigiPath Technology Company

USA . 34 parts In-Stock

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$16.038

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$14.755

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34

$16.038

$14.755

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ChromeModa Solutions

Germany . 3,922 parts In-Stock

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$16.365

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$13.419

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$16.365

$13.419

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IDEA Electronic Components Group

UK . 1,341 parts In-Stock

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$16.365

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$15.547

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$14.728

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1,341

$16.365

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$14.728

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One Stop Electronics

USA . 1,408 parts In-Stock

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$42.000

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Corphita

USA . 1,776 parts In-Stock

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Overview

Looking for a reliable Multiplexer & Demultiplexer for your electronic project? Look no further than the SN74CBTLV16292DGVR by Texas Instruments. With a reputation for quality and innovation, Texas Instruments delivers top-notch products that meet the highest standards in the industry. This versatile device offers 12 functions in a compact rectangular package, making it ideal for a wide range of applications. From signal routing to data transmission, this multiplexer & demultiplexer provides exceptional value, performance, and reliability to help you achieve your project goals with ease. Choose Texas Instruments for superior quality and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into circuit boards.

No. of Functions: 12

The multiplexer/demultiplexer offers 12 functions, providing versatility and flexibility in signal routing.

Propagation Delay (tpd): 7.1 ns

The low propagation delay ensures fast signal transmission, making the product suitable for high-speed applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for a high degree of control over the output signals, enhancing overall system performance.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer SN74CBTLV16292DGVR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G56

Length:

11.3 mm

No. of Functions:

12

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74CBTLV16292DGVR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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