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SN74S153DR

Texas Instruments

SN74S153DR by Texas Instruments

SN74S153DR by Texas Instruments is a TTL technology multiplexer/demultiplexer with 2 functions and 4 inputs. It operates at a supply voltage range of 4.75V to 5.25V, has a propagation delay of 9ns, and can handle load capacitance up to 15pF. This small outline package is suitable for commercial temperature grade applications requiring true output polarity control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,099 parts In-Stock

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Digiode

USA . 3,782 parts In-Stock

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3,782

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Distributors (Availability)

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Parana Technologies

USA . 645 parts In-Stock

1+ parts

$10.312

100+ parts

-

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$10.836

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645

$10.312

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$10.836

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ChromeModa Solutions

Germany . 3,277 parts In-Stock

1+ parts

$11.587

100+ parts

$9.501

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3,277

$11.587

$9.501

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IDEA Electronic Components Group

UK . 581 parts In-Stock

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$11.587

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$11.008

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$10.428

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581

$11.587

$11.008

$10.428

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AZTECH Wire

Italy . 676 parts In-Stock

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$13.514

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676

$13.514

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One Stop Electronics

USA . 605 parts In-Stock

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$14.000

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605

$14.000

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DigiPath Technology Company

USA . 2,163 parts In-Stock

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$10.447

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$10.447

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Corphita

USA . 1,826 parts In-Stock

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Overview

Upgrade your electronic projects with the high-quality SN74S153DR Multiplexer & Demultiplexer by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers reliable components that meet the demands of various applications. This versatile device features 2 functions and 4 inputs, making it a valuable addition to any project requiring efficient signal processing. Experience fast propagation delay, true output polarity, and a wide operating temperature range, all in a compact small outline package. Trust Texas Instruments for superior performance and innovation in electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer/demultiplexer.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Allows for multiplexing and demultiplexing operations to be performed simultaneously, increasing flexibility and functionality.

No. of Inputs: 4

Provides versatility in terms of input options, allowing for multiple signals to be processed.

Propagation Delay (tpd): 9 ns

Ensures fast signal processing, reducing latency and improving overall performance.

Technology: TTL

Utilizes TTL technology which is known for its high speed and reliability in digital signal processing applications.

Technical Specifications

Multiplexer & Demultiplexer SN74S153DR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SN74S153DR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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