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SN74LS258JP4

Texas Instruments

SN74LS258JP4 by Texas Instruments

SN74LS258JP4 by Texas Instruments is a TTL multiplexer with 4 functions and 2 inputs. It operates at a nominal voltage of 5V, with max I (ol) of 8A and output characteristics in 3-STATE. This IC is commonly used in commercial applications requiring dual terminal positions and has a temperature range from 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,880 parts In-Stock

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4,880

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Digiode

USA . 3,230 parts In-Stock

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3,230

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Distributors (Availability)

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One Stop Electronics

USA . 971 parts In-Stock

1+ parts

$4.000

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971

$4.000

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AZTECH Wire

Italy . 225 parts In-Stock

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$18.707

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225

$18.707

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Parana Technologies

USA . 1,509 parts In-Stock

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$24.698

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$25.360

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1,509

$24.698

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$25.360

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IDEA Electronic Components Group

UK . 543 parts In-Stock

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$27.750

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$26.362

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$24.975

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543

$27.750

$26.362

$24.975

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ChromeModa Solutions

Germany . 8 parts In-Stock

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$27.750

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$22.755

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8

$27.750

$22.755

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DigiPath Technology Company

USA . 974 parts In-Stock

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$25.019

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974

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$25.019

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Corphita

USA . 414 parts In-Stock

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Overview

Unlock the power of efficient data processing with the SN74LS258JP4 by Texas Instruments. This top-quality multiplexer/demultiplexer is designed to streamline your electronics projects, offering unmatched reliability and performance. Whether you're working on automation systems or communication devices, this versatile component will enhance your designs and deliver seamless operation. Trust Texas Instruments for cutting-edge technology and choose the SN74LS258JP4 for superior results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high durability and excellent thermal conductivity, which ensures reliable performance even in harsh environments.

No. of Functions: 4

Having multiple functions in a single device allows for more efficient use of space and simplifies circuit design.

No. of Inputs: 2

With multiple inputs, this multiplexer/demultiplexer can handle a variety of signals or data streams simultaneously.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and power supplies.

Maximum I (ol): 8 Amp

High output current capability allows for driving power-hungry components or loads without the need for additional amplification.

Output Characteristics: 3-STATE

The 3-STATE output enables the multiplexer/demultiplexer to disconnect from the signal lines, reducing power consumption and preventing signal interference when in high impedance state.

Technology: TTL

TTL technology offers high-speed operation and compatibility with a wide range of digital systems, making this product suitable for various applications.

Technical Specifications

Multiplexer & Demultiplexer SN74LS258JP4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS258JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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