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SN74ALVCH162260DGGR

Texas Instruments

SN74ALVCH162260DGGR by Texas Instruments

SN74ALVCH162260DGGR by Texas Instruments is a 2-function, 12-input multiplexer with a propagation delay of 6.1 ns and operates b/w -40 to 85°C. It is designed for industrial applications requiring a supply voltage range of 1.65V to 3.6V, featuring a small outline package with gull wing terminals for surface mounting in compact spaces.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 7,770 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 147 parts In-Stock

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Digiode

USA . 111 parts In-Stock

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Prism Electronics

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Parana Technologies

USA . 2,103 parts In-Stock

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$15.173

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$15.571

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DigiPath Technology Company

USA . 1,773 parts In-Stock

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$16.707

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ChromeModa Solutions

Germany . 1,675 parts In-Stock

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$17.048

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$13.979

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IDEA Electronic Components Group

UK . 841 parts In-Stock

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$17.048

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$16.196

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$15.343

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AZTECH Wire

Italy . 878 parts In-Stock

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$17.441

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One Stop Electronics

USA . 1,545 parts In-Stock

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$61.000

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Corphita

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Overview

Experience seamless multiplexing and demultiplexing with the SN74ALVCH162260DGGR by Texas Instruments. Crafted with precision and quality, this product offers unparalleled performance in a range of applications. Whether you're in telecommunications, industrial automation, or consumer electronics, this versatile component ensures reliable signal routing and management. With Texas Instruments' reputation for excellence backing it up, you can trust that you're getting top-notch quality and innovation. Upgrade your systems today and unlock the potential for smoother operations and enhanced efficiency with the SN74ALVCH162260DGGR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the multiplexer/demultiplexer.

No. of Functions: 2

Having 2 functions in one device helps in saving space and reducing the need for multiple components in a circuit.

No. of Inputs: 12

With a high number of inputs, this multiplexer/demultiplexer can handle complex input signals efficiently.

Propagation Delay (tpd): 6.1 ns

The low propagation delay ensures fast signal processing and minimal delay in switching between inputs and outputs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an efficient choice for various applications.

Technical Specifications

Multiplexer & Demultiplexer SN74ALVCH162260DGGR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

Length:

14 mm

Load Capacitance (CL):

50 pF

No. of Functions:

2

No. of Inputs:

12

No. of Outputs:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay (tpd):

6.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

SN74ALVCH162260DGGR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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