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5962-9061301EX

Texas Instruments

5962-9061301EX by Texas Instruments

The Texas Instruments 5962-9061301EX is a MIL-STD-883 compliant CMOS multiplexer with 3 inputs and 8 outputs. It operates b/w -55 to 125 °C, with a propagation delay of 57 ns at Vsup of 5V. Ideal for military applications requiring high-speed signal routing in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,358 parts In-Stock

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Digiode

USA . 4,181 parts In-Stock

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AZTECH Wire

Italy . 290 parts In-Stock

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$17.151

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Parana Technologies

USA . 996 parts In-Stock

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$28.342

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$46.393

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One Stop Electronics

USA . 1,275 parts In-Stock

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$31.000

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DigiPath Technology Company

USA . 800 parts In-Stock

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$31.208

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ChromeModa Solutions

Germany . 6,474 parts In-Stock

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$31.845

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$26.113

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IDEA Electronic Components Group

UK . 1,504 parts In-Stock

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$31.845

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$30.253

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$28.660

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Corphita

USA . 586 parts In-Stock

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Northwest PG Solutions

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Native Components

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Overview

Discover the unparalleled quality and reliability of the 5962-9061301EX by Texas Instruments, a leading manufacturer in the industry. This multiplexer & demultiplexer is designed with precision and care, ensuring top-notch performance in military-grade applications. With its ceramic, glass-sealed package body material and MIL-STD-883 screening level, this product promises durability and longevity. Experience the seamless operation and efficiency of this device, featuring 3 inputs, 8 outputs, and a nominal supply voltage of 5V. Trust Texas Instruments for high-quality components that deliver exceptional value and benefits to customers.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection, ensuring the reliable operation of the multiplexer & demultiplexer in various conditions.

Screening Level: MIL-STD-883

The MIL-STD-883 screening level ensures high-quality and reliable performance of the multiplexer & demultiplexer, making it suitable for military and aerospace applications.

No. of Inputs: 3

With 3 inputs, this multiplexer & demultiplexer allows for versatile input options, enabling it to handle multiple data sources efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard power sources, making integration easier and more convenient.

Propagation Delay (tpd): 57 ns

The low propagation delay of 57ns ensures fast switching and response times, crucial for applications requiring real-time data processing.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the multiplexer & demultiplexer to function reliably in elevated temperature environments without performance degradation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures that the multiplexer & demultiplexer can operate effectively in cold conditions, expanding its range of applications.

Output Polarity: TRUE

The true output polarity ensures accurate signal output, maintaining data integrity and reliability in communication systems and signal processing applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the multiplexer & demultiplexer energy-efficient and reliable in noisy environments.

No. of Outputs: 8

With 8 outputs, this multiplexer & demultiplexer can handle multiple output channels simultaneously, increasing its versatility and usability in complex data routing scenarios.

Technical Specifications

Multiplexer & Demultiplexer 5962-9061301EX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-GDIP-T16

No. of Functions:

1

No. of Inputs:

3

No. of Outputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

57 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

5962-9061301EX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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