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5962-00-581-4270

Texas Instruments

5962-00-581-4270 by Texas Instruments

The Texas Instruments 5962-00-581-4270 is a TTL multiplexer with 4 functions and 2 inputs. It has a propagation delay of 54 ns, operates b/w 0 to 70°C, and supports a max current of 8A. Ideal for commercial applications requiring high-speed signal routing in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,634 parts In-Stock

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5,634

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Digiode

USA . 4,322 parts In-Stock

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4,322

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Distributors (Availability)

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AZTECH Wire

Italy . 734 parts In-Stock

1+ parts

$13.473

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734

$13.473

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Parana Technologies

USA . 2,081 parts In-Stock

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$23.591

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$24.222

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$23.591

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$24.222

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DigiPath Technology Company

USA . 1,257 parts In-Stock

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$25.977

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1,257

$25.977

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ChromeModa Solutions

Germany . 3,589 parts In-Stock

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$26.507

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$21.736

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3,589

$26.507

$21.736

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IDEA Electronic Components Group

UK . 1,916 parts In-Stock

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$26.507

100+ parts

$25.182

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$23.856

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1,916

$26.507

$25.182

$23.856

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One Stop Electronics

USA . 248 parts In-Stock

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$45.000

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248

$45.000

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Corphita

USA . 4,925 parts In-Stock

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4,925

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Native Components

USA . 555 parts In-Stock

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555

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Northwest PG Solutions

USA . 66 parts In-Stock

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Overview

Upgrade your electronic projects with the top-quality 5962-00-581-4270 by Texas Instruments! This multiplexer & demultiplexer offers unmatched reliability and performance, thanks to Texas Instruments' reputation for excellence. Perfect for a wide range of applications, this versatile component allows you to streamline your circuit design and enhance functionality. Say goodbye to limitations and hello to endless possibilities with the 5962-00-581-4270 from Texas Instruments - experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal stability and high mechanical strength, making this multiplexer/demultiplexer durable and reliable for long-term use.

Propagation Delay At Nominal Supply: 54 ns

Low propagation delay ensures fast data transmission and minimal delay in signal processing, making this product efficient in high-speed applications.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, simplifying circuit design and saving space on the PCB.

No. of Inputs: 2

With 2 inputs, this multiplexer/demultiplexer can handle multiple data streams efficiently, offering versatility in data routing and management.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into electronic systems and PCB layouts, facilitating installation and connection with other components.

No. of Terminals: 16

Having 16 terminals provides flexibility in connectivity options and allows for multiple input/output configurations, enhancing the versatility of this device.

Maximum I (ol): 8 Amp

High maximum output current rating ensures robust performance and reliability in handling heavy loads, making this multiplexer/demultiplexer suitable for a wide range of applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this device can withstand harsh environmental conditions and maintain stable performance in demanding industrial settings.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures that this multiplexer/demultiplexer can operate effectively even in cold environments, offering reliability in varied temperature conditions.

Technology: TTL

TTL technology provides fast switching speeds and low power consumption, making this device energy-efficient and ideal for applications requiring high-speed data processing.

Technical Specifications

Multiplexer & Demultiplexer 5962-00-581-4270 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay At Nominal Supply:

54 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-00-581-4270 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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