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5962-00-543-2299

Texas Instruments

5962-00-543-2299 by Texas Instruments

The Texas Instruments 5962-00-543-2299 is a MILITARY-grade Multiplexer & Demultiplexer with 4 functions, 2 inputs, and a supply voltage of 5V. It operates b/w -55°C to 125°C, featuring TTL technology and THROUGH-HOLE terminals. Ideal for military applications requiring high reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,452 parts In-Stock

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4,452

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Digiode

USA . 2,847 parts In-Stock

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2,847

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Distributors (Availability)

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One Stop Electronics

USA . 1,366 parts In-Stock

1+ parts

$5.000

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1,366

$5.000

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AZTECH Wire

Italy . 302 parts In-Stock

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$10.434

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302

$10.434

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Parana Technologies

USA . 507 parts In-Stock

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$22.164

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$22.795

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507

$22.164

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$22.795

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ChromeModa Solutions

Germany . 6,422 parts In-Stock

1+ parts

$24.903

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$20.420

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6,422

$24.903

$20.420

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IDEA Electronic Components Group

UK . 1,101 parts In-Stock

1+ parts

$24.903

100+ parts

$23.658

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$22.413

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1,101

$24.903

$23.658

$22.413

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Corphita

USA . 3,704 parts In-Stock

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3,704

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DigiPath Technology Company

USA . 1,978 parts In-Stock

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$22.453

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1,978

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$22.453

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Northwest PG Solutions

USA . 1,034 parts In-Stock

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1,034

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Native Components

USA . 499 parts In-Stock

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499

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Overview

Upgrade your electronic systems with the high-quality 5962-00-543-2299 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch multiplexer & demultiplexer components that excel in reliability and performance. Whether you're working on military-grade applications or demanding industrial projects, this product offers unparalleled value with its durable ceramic package body material, multiple functions, and dual terminal position. Experience seamless integration and enhanced efficiency with Texas Instruments - choose excellence for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Provides excellent heat dissipation and durability, making the product suitable for harsh environments and extended use.

No. of Functions: 4

Offers versatility and flexibility in routing multiple input signals to the desired output, increasing the functionality of the product.

Screening Level: MIL-STD-883 Class B (Modified)

Ensures high reliability and quality, meeting stringent military standards for performance in demanding applications.

No. of Inputs: 2

Efficiently combines two input signals into one output or splits one input into two outputs, providing signal routing options.

Package Shape: RECTANGULAR

Facilitates easy integration and placement on circuit boards, optimizing space usage and overall system design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, ensuring compatibility with standard power sources and simplifying system design.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, enabling reliable performance in a wide range of operating conditions.

Minimum Operating Temperature: -55 °C

Capable of functioning in cold temperature settings, expanding the product's usability in diverse environments.

Temperature Grade: MILITARY

Designed to meet rugged military specifications, ensuring durability and performance in harsh environments and critical missions.

Technology: TTL

Utilizes trusted TTL technology for signal processing, offering fast response times and low power consumption for efficient operation.

Technical Specifications

Multiplexer & Demultiplexer 5962-00-543-2299 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-00-543-2299 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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