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5962-00-430-2641

Texas Instruments

5962-00-430-2641 by Texas Instruments

The Texas Instruments 5962-00-430-2641 is a ceramic multiplexer with 4 functions, 2 inputs, and 16 terminals. It operates at a nominal voltage of 5V with a propagation delay of 27ns. Ideal for commercial applications requiring TTL technology and a max operating temperature of 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,250 parts In-Stock

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4,250

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Digiode

USA . 551 parts In-Stock

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551

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Mil-Aero Solutions, Inc.

USA . 75 parts In-Stock

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75

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Native Components

USA . 757 parts In-Stock

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$0.960

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757

$0.960

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Northwest PG Solutions

USA . 167 parts In-Stock

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$1.055

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167

$1.055

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Parana Technologies

USA . 1,937 parts In-Stock

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$10.916

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$11.385

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1,937

$10.916

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$11.385

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ChromeModa Solutions

Germany . 2,553 parts In-Stock

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$12.265

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$10.057

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2,553

$12.265

$10.057

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IDEA Electronic Components Group

UK . 978 parts In-Stock

1+ parts

$12.265

100+ parts

$11.652

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$11.038

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978

$12.265

$11.652

$11.038

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AZTECH Wire

Italy . 791 parts In-Stock

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$13.156

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791

$13.156

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One Stop Electronics

USA . 519 parts In-Stock

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$20.000

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519

$20.000

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DigiPath Technology Company

USA . 2,085 parts In-Stock

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$11.058

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Corphita

USA . 122 parts In-Stock

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Overview

Enhance your electronic circuits with the reliable 5962-00-430-2641 multiplexer & demultiplexer by Texas Instruments. Crafted with quality ceramic material, this component offers fast propagation delay and versatile functionality with 4 functions and 2 inputs. Ideal for a wide range of applications, this product ensures seamless integration and optimal performance. Trust in Texas Instruments' reputation for top-notch electronics, and experience the value and benefits of this high-quality component in your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

The use of ceramic as the package body material provides excellent thermal and mechanical properties, ensuring reliability and durability for the product.

Propagation Delay At Nominal Supply: 27 ns

With a fast propagation delay, this multiplexer/demultiplexer allows for quick data transfer and efficient operation within electronic systems.

No. of Functions: 4

Having 4 functions in one device increases the versatility and functionality of the product, allowing for multiple tasks to be performed simultaneously.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes this product compatible with a wide range of electronic systems, simplifying integration and use.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this multiplexer/demultiplexer can withstand elevated temperatures without compromising its performance, making it suitable for various environments.

Technical Specifications

Multiplexer & Demultiplexer 5962-00-430-2641 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

48 mA

Propagation Delay At Nominal Supply:

27 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-00-430-2641 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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