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5962-00-277-0188

Texas Instruments

5962-00-277-0188 by Texas Instruments

Texas Instruments 5962-00-277-0188 is a TTL multiplexer with 4 functions, 2 inputs, and 16 terminals. It operates at a supply voltage of 5V with a propagation delay of 27ns. Ideal for commercial applications requiring high-speed signal switching in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,164 parts In-Stock

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4,164

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Digiode

USA . 3,223 parts In-Stock

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3,223

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Distributors (Availability)

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AZTECH Wire

Italy . 207 parts In-Stock

1+ parts

$5.875

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207

$5.875

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Parana Technologies

USA . 1,859 parts In-Stock

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$24.515

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-

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$25.181

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1,859

$24.515

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$25.181

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DigiPath Technology Company

USA . 458 parts In-Stock

1+ parts

$26.994

100+ parts

$24.835

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458

$26.994

$24.835

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ChromeModa Solutions

Germany . 5,515 parts In-Stock

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$27.545

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$22.587

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5,515

$27.545

$22.587

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IDEA Electronic Components Group

UK . 1,589 parts In-Stock

1+ parts

$27.545

100+ parts

$26.168

1k+ parts

$24.790

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1,589

$27.545

$26.168

$24.790

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One Stop Electronics

USA . 1,427 parts In-Stock

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$61.000

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1,427

$61.000

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Corphita

USA . 4,915 parts In-Stock

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4,915

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Native Components

USA . 486 parts In-Stock

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486

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Northwest PG Solutions

USA . 454 parts In-Stock

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454

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Overview

Enhance your electronic systems with the 5962-00-277-0188 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge multiplexer & demultiplexer technology. With 4 functions, 2 inputs, and a quick 27 ns propagation delay, this versatile device is perfect for a wide range of applications. From telecommunications to industrial automation, this product offers exceptional value, efficiency, and performance. Upgrade your projects today with Texas Instruments' superior components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials provide good durability and protection for the internal components of the multiplexer & demultiplexer, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 27 ns

Low propagation delay ensures fast processing of signals, making this multiplexer & demultiplexer suitable for high-speed applications.

No. of Functions: 4

Having multiple functions in a single device allows for more flexibility in signal routing and management, making this product versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration with other components easier and more efficient, reducing compatibility issues.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this multiplexer & demultiplexer can withstand harsh environmental conditions and maintain reliable performance.

Technical Specifications

Multiplexer & Demultiplexer 5962-00-277-0188 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

48 mA

Propagation Delay At Nominal Supply:

27 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-00-277-0188 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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