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54F153FMQB

Texas Instruments

54F153FMQB by Texas Instruments

The Texas Instruments 54F153FMQB is a dual-function multiplexer with 4 inputs, operating at a supply voltage range of 4.5V to 5.5V. With a propagation delay of 9ns and MILITARY temperature grade, it's ideal for high-speed signal routing in critical applications. This flatpack device features TTL technology and can withstand temperatures from -55°C to 125°C.

Median Price

$3.520

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,865 parts In-Stock

1+ parts

$3.230

100+ parts

$3.170

1k+ parts

$3.100

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3,865

$3.230

$3.170

$3.100

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DigiKey

USA . 3,865 parts In-Stock

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$3.810

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3,865

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$3.810

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Distributors (In-Stock)

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Digiode

USA . 4,294 parts In-Stock

1+ parts

$3.658

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4,294

$3.658

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Vyrian

USA . 1,533 parts In-Stock

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$3.810

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1,533

$3.810

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DigiKey Marketplace

USA . 3,865 parts In-Stock

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3,865

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Resion

USA . 1,373 parts In-Stock

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1,373

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Electronic Expediters

USA . 634 parts In-Stock

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634

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Anansix

USA . 112 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,691 parts In-Stock

1+ parts

$3.465

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4,691

$3.465

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Parana Technologies

USA . 1,051 parts In-Stock

1+ parts

$14.364

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$14.810

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1,051

$14.364

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$14.810

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DigiPath Technology Company

USA . 2,292 parts In-Stock

1+ parts

$15.816

100+ parts

$14.551

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2,292

$15.816

$14.551

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ChromeModa Solutions

Germany . 1,146 parts In-Stock

1+ parts

$16.139

100+ parts

$13.234

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1,146

$16.139

$13.234

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IDEA Electronic Components Group

UK . 648 parts In-Stock

1+ parts

$16.139

100+ parts

$15.332

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$14.525

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648

$16.139

$15.332

$14.525

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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2,780

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Northwest PG Solutions

USA . 1,759 parts In-Stock

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Native Components

USA . 715 parts In-Stock

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715

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Supply Digital

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633

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Overview

Upgrade your electronic projects with the 54F153FMQB by Texas Instruments, a top-quality multiplexer & demultiplexer that delivers unmatched performance and reliability. With a military-grade temperature grade and true output polarity, this versatile component is perfect for a wide range of applications. From aerospace to telecommunications, this flatpack package style device offers customers exceptional value, efficiency, and precision. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing the overall size of the system.

No. of Functions: 2

Offers versatility and flexibility in signal routing applications.

No. of Inputs: 4

Provides multiple input options for signal selection and processing.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently within standard voltage ranges, ensuring compatibility with common power sources.

Package Style (Meter): FLATPACK

Suitable for high-density packaging, optimizing space utilization in electronic systems.

Propagation Delay (tpd): 9 ns

Offers fast data processing speed, allowing for quick signal routing and switching.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -55 °C

Can withstand extreme cold conditions, making it suitable for a wide range of operating environments.

Technology: TTL

Utilizes trusted and established TTL technology for reliable signal processing and compatibility.

Technical Specifications

Multiplexer & Demultiplexer 54F153FMQB attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDFP-F16

Length:

9.6645 mm

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

9 ns

Maximum Seated Height:

2.032 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.604 mm

Trade Compliance

54F153FMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-245-1739, 5962012451739, 5962-01-172-4877, 5962011724877

NIIN

012451739, 011724877

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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