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54F157AFM

Texas Instruments

54F157AFM by Texas Instruments

The Texas Instruments 54F157AFM is a TTL multiplexer with 4 functions and 2 inputs. It operates at a supply voltage range of 4.5V to 5.5V, with a propagation delay of 7.5ns. Ideal for military-grade applications requiring high-speed signal switching in compact spaces due to its small form factor and wide temperature range support from -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,247 parts In-Stock

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Digiode

USA . 3,134 parts In-Stock

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Anansix

USA . 817 parts In-Stock

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Native Components

USA . 646 parts In-Stock

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$0.036

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$0.034

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$0.036

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AZTECH Wire

Italy . 680 parts In-Stock

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$13.718

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680

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Parana Technologies

USA . 722 parts In-Stock

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$26.235

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$26.829

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DigiPath Technology Company

USA . 615 parts In-Stock

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$28.887

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$26.576

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615

$28.887

$26.576

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ChromeModa Solutions

Germany . 6,996 parts In-Stock

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$29.477

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$24.171

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$29.477

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IDEA Electronic Components Group

UK . 2,285 parts In-Stock

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$29.477

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$28.003

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$26.529

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$29.477

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One Stop Electronics

USA . 634 parts In-Stock

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$43.000

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Corphita

USA . 4,307 parts In-Stock

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Northwest PG Solutions

USA . 1,006 parts In-Stock

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Overview

Experience unmatched performance and reliability with the Texas Instruments 54F157AFM multiplexer & demultiplexer. Crafted with precision using top-quality materials, this versatile component offers seamless integration and exceptional functionality. Ideal for a wide range of applications, this product delivers superior results with its 4 functions and 2 inputs, all while maintaining a nominal supply voltage of 5V. Trust in Texas Instruments for cutting-edge technology and innovative solutions that bring value and benefits to your projects. Elevate your designs with the 54F157AFM and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability of the product, making it suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and improving assembly efficiency.

No. of Functions: 4

With 4 functions, this multiplexer/demultiplexer offers versatility in signal routing and control, making it a cost-effective solution for complex systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard power sources, ensuring ease of integration into existing circuits.

Propagation Delay (tpd): 7.5 ns

The low propagation delay of 7.5 ns ensures fast and efficient signal processing, making it suitable for high-speed applications.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, the military-grade component ensures reliability in harsh environmental conditions, making it ideal for mission-critical systems.

Technology: TTL

Utilizing TTL technology guarantees compatibility with TTL logic levels, facilitating seamless communication with other TTL-based devices.

Technical Specifications

Multiplexer & Demultiplexer 54F157AFM attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDFP-F16

Length:

9.6645 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

7.5 ns

Maximum Seated Height:

2.032 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.604 mm

Trade Compliance

54F157AFM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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