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54F157ADMQB

Texas Instruments

54F157ADMQB by Texas Instruments

The Texas Instruments 54F157ADMQB is a TTL multiplexer with 8 inputs and 4 outputs. It operates at a supply voltage range of 4.5V to 5.5V, with a propagation delay of 7.5ns. Ideal for military-grade applications requiring fast signal switching in compact spaces due to its small package size and high-temperature tolerance up to 125°C.

Median Price

$77.500

Lifecycle Status

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27

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1k+

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Freelance Electronics

USA . 46 parts In-Stock

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Component Electronics Inc.

Canada . 1 parts In-Stock

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American Microsemiconductor Inc.

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TEDSS.com

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Digiode

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NexGen Digital

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First Choice Components Inc.

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Prism Electronics

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ECAB

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Odi Ramu Company

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Electronics Depot

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Sunrise Surplus Inc.

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North Shore Components

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PC Components Company LLC

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MISTER SPROCKETS

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Connector Distribution Corp

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Right Parts Inc.

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Electro Mavin

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AZTECH Wire

Italy . 535 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 1,514 parts In-Stock

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IDEA Electronic Components Group

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ChromeModa Solutions

Germany . 682 parts In-Stock

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One Stop Electronics

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Corphita

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Supply Digital

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Authorized Procurement Solutions

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Northwest PG Solutions

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Kepictronics

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Montclair Electronics, Inc.

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your projects with the 54F157ADMQB by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. This multiplexer & demultiplexer boasts a range of applications, making it an essential component for various electronic systems. With a nominal supply voltage of 5V and a compact package style, this product offers unparalleled performance and versatility. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and reliable performance, making the product suitable for harsh environments.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer can handle multiple input signals efficiently.

Propagation Delay (tpd): 7.5 ns

The quick propagation delay ensures fast switching between inputs and outputs, improving overall system response time.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without performance degradation.

Technology: TTL

The TTL technology used in this product ensures high-speed operation and compatibility with other TTL devices.

Technical Specifications

Multiplexer & Demultiplexer 54F157ADMQB attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Family:

F/FAST

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

7.5 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

54F157ADMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-245-6288, 5962012456288, 5962-01-214-9067, 5962012149067, 5962-01-188-3813, 5962011883813

NIIN

012456288, 012149067, 011883813

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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