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SN74AS158DRE4

Texas Instruments

SN74AS158DRE4 by Texas Instruments

SN74AS158DRE4 by Texas Instruments is a TTL technology multiplexer with 4 functions, 2 inputs, and 5V nominal voltage. It has a propagation delay of 5ns and operates in commercial temperature grade. This IC is used for signal routing applications in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,973 parts In-Stock

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5,973

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Digiode

USA . 1,282 parts In-Stock

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1,282

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Distributors (Availability)

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AZTECH Wire

Italy . 621 parts In-Stock

1+ parts

$5.885

100+ parts

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621

$5.885

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One Stop Electronics

USA . 1,239 parts In-Stock

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$12.000

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1,239

$12.000

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Parana Technologies

USA . 1,000 parts In-Stock

1+ parts

$28.266

100+ parts

$2,624.881

1k+ parts

$25.439

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1,000

$28.266

$2,624.881

$25.439

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DigiPath Technology Company

USA . 103 parts In-Stock

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$31.124

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103

$31.124

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ChromeModa Solutions

Germany . 2,284 parts In-Stock

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$31.759

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$26.042

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2,284

$31.759

$26.042

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IDEA Electronic Components Group

UK . 80 parts In-Stock

1+ parts

$31.759

100+ parts

$30.171

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$28.583

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80

$31.759

$30.171

$28.583

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Microchip USA

USA . 5,757 parts In-Stock

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Corphita

USA . 3,020 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the SN74AS158DRE4 multiplexer & demultiplexer. This versatile component offers customers a seamless solution for multiple input/output applications, providing fast processing speeds and low power consumption. With Texas Instruments' reputation for excellence in electronic components, you can trust that the SN74AS158DRE4 will deliver superior performance and value for all your circuit design needs. Elevate your projects with this advanced technology and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Propagation Delay At Nominal Supply: 5 ns

Low propagation delay of 5 ns ensures high-speed signal processing, making the product ideal for time-critical applications.

Surface Mount: YES

Surface mount capability provides easy and efficient PCB assembly, saving time and effort during installation.

No. of Functions: 4

Having 4 functions in one device saves space on the PCB and reduces the need for multiple components, simplifying the overall design.

No. of Inputs: 2

With 2 input ports, the multiplexer/demultiplexer can handle multiple input signals, enhancing its versatility for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems convenient.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF minimizes signal distortion and ensures signal integrity, especially in high-frequency applications.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity and interfacing with other components, making the product user-friendly and versatile.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand a wide range of environmental conditions, enhancing its reliability.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems, making the product suitable for various applications in the industry.

Technical Specifications

Multiplexer & Demultiplexer SN74AS158DRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

22.5 mA

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74AS158DRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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