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SNC54S158W

Texas Instruments

SNC54S158W by Texas Instruments

The Texas Instruments SNC54S158W is a MIL-STD-883 Class B multiplexer with 4 functions, 2 inputs, and operates at -55 to 125°C. It has a supply voltage of 5V, flatpack style, and dual terminal position. Ideal for military applications requiring TTL technology in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,035 parts In-Stock

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4,035

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Digiode

USA . 285 parts In-Stock

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285

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Distributors (Availability)

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One Stop Electronics

USA . 919 parts In-Stock

1+ parts

$7.000

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-

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919

$7.000

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AZTECH Wire

Italy . 362 parts In-Stock

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$15.315

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362

$15.315

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Parana Technologies

USA . 322 parts In-Stock

1+ parts

$28.613

100+ parts

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$49.556

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322

$28.613

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$49.556

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ChromeModa Solutions

Germany . 3,087 parts In-Stock

1+ parts

$32.149

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$26.362

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3,087

$32.149

$26.362

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IDEA Electronic Components Group

UK . 529 parts In-Stock

1+ parts

$32.149

100+ parts

$30.542

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$28.934

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529

$32.149

$30.542

$28.934

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Corphita

USA . 4,911 parts In-Stock

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4,911

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DigiPath Technology Company

USA . 1,773 parts In-Stock

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$28.986

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1,773

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$28.986

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Kepictronics

USA . 46 parts In-Stock

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46

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Overview

Elevate your electronic designs with the high-quality SNC54S158W multiplexer by Texas Instruments. With a reputation for excellence in manufacturing, TI delivers top-notch products that exceed industry standards. This versatile component is perfect for a wide range of applications in multiplexing and demultiplexing circuits. Experience the value and benefits of this product with its reliable performance, superior functionality, and easy integration. Upgrade your projects with the SNC54S158W and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers good thermal conductivity and mechanical strength, making the product reliable and durable.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort.

No. of Functions: 4

Having multiple functions in a single device helps in space-saving and simplifies the circuit design.

Screening Level: MIL-STD-883 Class B (Modified)

Military standard screening ensures high reliability and performance in harsh environments.

No. of Inputs: 2

Having multiple inputs allows for versatile signal routing and switching capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with many existing systems and circuits.

No. of Terminals: 16

Having a high number of terminals provides flexibility in connectivity and integration within a larger system.

Maximum Operating Temperature: 125 °C

Operating at a high temperature range ensures reliability and performance under extreme conditions.

Technology: TTL

Using Transistor-Transistor Logic technology ensures fast switching speeds and low power consumption.

Technical Specifications

Multiplexer & Demultiplexer SNC54S158W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNC54S158W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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