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MC10E122FNR2G

Onsemi

MC10E122FNR2G by Onsemi

MC10E122FNR2G by Onsemi is a Logic Gate with 9 functions, 0.5 ns propagation delay at 5V. It operates b/w 0-85°C, with -5.2V power supply and 4.2-5.7V voltage range. Suitable for applications requiring fast signal processing in compact spaces due to its small chip carrier package style and surface mount capability.

Median Price

$6.244

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

$4.670

12,000

-

$5.550

$4.960

$4.670

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

12,000

-

$6.938

$6.200

$5.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,003 parts In-Stock

1+ parts

$5.871

100+ parts

-

1k+ parts

-

10k+ parts

-

1,003

$5.871

-

-

-

Vyrian

USA . 7,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,466

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 439 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$5.562

-

-

-

Corohmni

South Africa . 441 parts In-Stock

1+ parts

$6.180

100+ parts

-

1k+ parts

-

10k+ parts

-

441

$6.180

-

-

-

Component Stockers USA

USA . 13,060 parts In-Stock

1+ parts

$6.320

100+ parts

$5.950

1k+ parts

$5.380

10k+ parts

$5.380

13,060

$6.320

$5.950

$5.380

$5.380

AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$21.800

100+ parts

-

1k+ parts

-

10k+ parts

-

393

$21.800

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,272

-

-

-

-

Continental Prestige Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

$5.360

1k+ parts

-

10k+ parts

-

12,000

-

$5.360

-

-

Kulean Microsystems

USA . 4,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,330

-

-

-

-

TANS Electronics

Latvia . 3,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,967

-

-

-

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SupplyDigital Components

Austria . 1,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,250

-

-

-

-

Problanco Electronics

Mexico . 1,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,113

-

-

-

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UHIMA Technologies

Türkiye . 535 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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535

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-

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Microchip USA

USA . 150 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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150

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-

-

Overview

Unleash the power of advanced logic gates with the MC10E122FNR2G by Onsemi. With a reputation for top-quality products, Onsemi delivers cutting-edge solutions for a wide range of applications. This versatile chip carrier package offers lightning-fast propagation delay and open-emitter output characteristics, making it ideal for demanding electronics projects. Trust Onsemi to provide reliable performance and innovative technology, giving you the edge you need to succeed. Elevate your designs with the MC10E122FNR2G and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 0.5 ns

The low propagation delay ensures fast signal processing and high performance.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort.

No. of Functions: 9

Provides versatility and flexibility in designing complex logic circuits.

Nominal Supply Voltage: 5 V

Operates efficiently at a standard voltage level, making it compatible with most systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliability in harsh environments.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power consumption.

Technical Specifications

Logic Gates MC10E122FNR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -4.2V TO -5.7V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

No. of Functions:

9

No. of Inputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

57 mA

Propagation Delay At Nominal Supply:

.5 ns

Propagation Delay (tpd):

.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10E122FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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