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MC100LVEL05DTG

Onsemi

MC100LVEL05DTG by Onsemi

MC100LVEL05DTG by Onsemi is a Logic Gate with 0.44 ns Propagation Delay, 2 Inputs, and 3.3V Nominal Voltage. Ideal for high-speed applications in industrial settings due to ECL technology and -40 to 85 °C operating temperature range. Package style is small outline, thin profile, shrink pitch with gull wing terminals.

Median Price

$3.913

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,256 parts In-Stock

1+ parts

$18.400

100+ parts

$11.500

1k+ parts

-

10k+ parts

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2,256

$18.400

$11.500

-

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Rochester

USA . 134 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

134

-

$3.130

$2.800

$2.630

Verical

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

$3.288

100

-

$3.913

$3.500

$3.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,147 parts In-Stock

1+ parts

$3.306

100+ parts

-

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2,147

$3.306

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Vyrian

USA . 2,234 parts In-Stock

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2,234

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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6

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Distributors (Availability)

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Corphita

USA . 438 parts In-Stock

1+ parts

$3.132

100+ parts

-

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438

$3.132

-

-

-

Corohmni

South Africa . 206 parts In-Stock

1+ parts

$3.480

100+ parts

-

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206

$3.480

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Component Stockers USA

USA . 102 parts In-Stock

1+ parts

$3.580

100+ parts

$3.370

1k+ parts

-

10k+ parts

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102

$3.580

$3.370

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-

AZTECH Wire

Italy . 161 parts In-Stock

1+ parts

$12.330

100+ parts

-

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161

$12.330

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QUARKTWIN TECHNOLOGY LTD

USA . 11,764 parts In-Stock

1+ parts

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11,764

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Kulean Microsystems

USA . 5,736 parts In-Stock

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5,736

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Microchip USA

USA . 5,254 parts In-Stock

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Problanco Electronics

Mexico . 3,210 parts In-Stock

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SupplyDigital Components

Austria . 546 parts In-Stock

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546

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UHIMA Technologies

Türkiye . 150 parts In-Stock

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Continental Prestige Electronics

USA . 134 parts In-Stock

1+ parts

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$4.170

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134

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$4.170

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Perfect Parts

USA . 18 parts In-Stock

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18

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TANS Electronics

Latvia . 3 parts In-Stock

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Overview

Experience unparalleled speed and reliability with the MC100LVEL05DTG by Onsemi. Crafted with precision and expertise, this logic gate offers lightning-fast propagation delay of just 0.44 ns, making it perfect for high-speed applications in industrial settings. With a compact design and durable package body material, this product ensures long-lasting performance and efficiency. Trust in the quality and innovation of Onsemi to deliver superior products that exceed expectations. Unlock the power of cutting-edge technology with the MC100LVEL05DTG and revolutionize your operations today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.45 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed, making this product versatile for various circuit designs.

Nominal Supply Voltage / Vsup: 3.3V

Operating at a standard nominal supply voltage makes this product compatible with many existing systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and industrial applications.

Technology: ECL

Utilizing ECL technology, this product offers high-speed performance and low power consumption, making it efficient for certain applications.

Technical Specifications

Logic Gates MC100LVEL05DTG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -3.8V

Family:

100LVEL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

26 mA

Propagation Delay At Nominal Supply:

.45 ns

Propagation Delay (tpd):

.44 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100LVEL05DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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