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MC100EP105MNG

Onsemi

MC100EP105MNG by Onsemi

MC100EP105MNG by Onsemi is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 0.35 ns at 3.3V, making it ideal for high-speed applications in industrial settings. With a wide operating temperature range (-40 to 85 °C) and compact square package style, it offers reliable performance in various electronic systems.

Median Price

$12.088

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 64 parts In-Stock

1+ parts

$29.500

100+ parts

-

1k+ parts

-

10k+ parts

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64

$29.500

-

-

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Rochester

USA . 31,399 parts In-Stock

1+ parts

-

100+ parts

$9.670

1k+ parts

$8.650

10k+ parts

$8.140

31,399

-

$9.670

$8.650

$8.140

Verical

USA . 10,878 parts In-Stock

1+ parts

-

100+ parts

$12.088

1k+ parts

$10.813

10k+ parts

$10.175

10,878

-

$12.088

$10.813

$10.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,428 parts In-Stock

1+ parts

$10.232

100+ parts

-

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2,428

$10.232

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Vyrian

USA . 5,484 parts In-Stock

1+ parts

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5,484

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,064 parts In-Stock

1+ parts

$9.150

100+ parts

-

1k+ parts

-

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-

14,064

$9.150

-

-

-

Corphita

USA . 1,610 parts In-Stock

1+ parts

$9.693

100+ parts

-

1k+ parts

-

10k+ parts

-

1,610

$9.693

-

-

-

Corohmni

South Africa . 62 parts In-Stock

1+ parts

$10.770

100+ parts

-

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62

$10.770

-

-

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AZTECH Wire

Italy . 775 parts In-Stock

1+ parts

$20.200

100+ parts

-

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775

$20.200

-

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Continental Prestige Electronics

USA . 31,399 parts In-Stock

1+ parts

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31,399

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Kulean Microsystems

USA . 7,021 parts In-Stock

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7,021

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SupplyDigital Components

Austria . 6,651 parts In-Stock

1+ parts

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6,651

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Problanco Electronics

Mexico . 3,925 parts In-Stock

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3,925

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UHIMA Technologies

Türkiye . 750 parts In-Stock

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750

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Perfect Parts

USA . 634 parts In-Stock

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634

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Microchip USA

USA . 494 parts In-Stock

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494

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TANS Electronics

Latvia . 457 parts In-Stock

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457

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Authorized Procurement Solutions

USA . 64 parts In-Stock

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64

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GreenTree Electronics

Israel . 64 parts In-Stock

1+ parts

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64

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Overview

Enhance your electronic designs with the MC100EP105MNG logic gate by Onsemi. Crafted with precision and reliability, Onsemi guarantees top-notch quality and performance in all their products. Ideal for a wide range of applications, this logic gate offers fast propagation delay and low power consumption, making it a valuable addition to any project. Experience seamless functionality and efficiency with the MC100EP105MNG, setting new standards in the world of electronic components. Elevate your designs with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 375 ns

Low propagation delay ensures fast response time and efficient signal processing.

Surface Mount: YES

Surface mount capability allows for easy and flexible integration into circuit boards.

No. of Functions: 4

Multiple functions in a single chip offer enhanced functionality and space-saving design.

No. of Inputs: 2

Simplified input structure makes it easier to control and operate.

Package Shape: SQUARE

Square shape facilitates efficient placement and alignment within circuit layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard supply voltages for easy integration into existing systems.

Power Supplies (V): -4.5

Supports a wide range of power supplies for versatile application scenarios.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments.

Width: 5 mm

Compact width enables space-efficient circuit board designs.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement reduces power consumption.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and connection flexibility.

Maximum Power Supply Current (ICC): 85 mA

Low power supply current consumption for energy-efficient operation.

Technical Specifications

Logic Gates MC100EP105MNG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay At Nominal Supply:

375 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MC100EP105MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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