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MC100EL12DTG

Onsemi

MC100EL12DTG by Onsemi

MC100EL12DTG by Onsemi is a Logic Gate with 2 inputs, operating at -40 to 85 °C. It has a propagation delay of 0.45 ns and requires a supply voltage b/w 4.2V to 5.7V. Ideal for industrial applications requiring fast signal processing in compact spaces.

Median Price

$3.138

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,855 parts In-Stock

1+ parts

$3.280

100+ parts

$3.080

1k+ parts

$2.780

10k+ parts

-

18,855

$3.280

$3.080

$2.780

-

Farnell

UK . 18,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.810

10k+ parts

-

18,855

-

-

$2.810

-

Verical

USA . 18,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.138

10k+ parts

$2.950

18,560

-

-

$3.138

$2.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,336 parts In-Stock

1+ parts

$2.964

100+ parts

-

1k+ parts

-

10k+ parts

-

2,336

$2.964

-

-

-

Vyrian

USA . 4,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,551

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 66 parts In-Stock

1+ parts

$2.808

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$2.808

-

-

-

Corohmni

South Africa . 317 parts In-Stock

1+ parts

$3.120

100+ parts

-

1k+ parts

-

10k+ parts

-

317

$3.120

-

-

-

AZTECH Wire

Italy . 152 parts In-Stock

1+ parts

$15.210

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$15.210

-

-

-

Continental Prestige Electronics

USA . 18,855 parts In-Stock

1+ parts

-

100+ parts

$2.810

1k+ parts

-

10k+ parts

-

18,855

-

$2.810

-

-

Kulean Microsystems

USA . 7,863 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,863

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-

-

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Problanco Electronics

Mexico . 6,787 parts In-Stock

1+ parts

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100+ parts

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6,787

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-

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Microchip USA

USA . 5,478 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,478

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-

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SupplyDigital Components

Austria . 4,498 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,498

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TANS Electronics

Latvia . 3,667 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,667

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-

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UHIMA Technologies

Türkiye . 389 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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389

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Overview

Discover the unparalleled performance and reliability of the MC100EL12DTG logic gate by Onsemi. With a commitment to excellence, Onsemi delivers cutting-edge technology that sets the standard in the industry. Ideal for a wide range of applications, this logic gate provides exceptional speed and precision. Experience seamless integration and enhanced functionality with the MC100EL12DTG, offering unmatched value and efficiency to customers looking for top-of-the-line solutions in logic gates.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the internal components of the logic gates.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed, making this product suitable for simple digital circuits.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard digital systems and components.

Propagation Delay (tpd): 0.45 ns

The low propagation delay of 0.45 ns ensures fast and efficient operation of the logic gates, making them ideal for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, these logic gates can function reliably in a range of environments and conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C allows for use in a variety of different temperature conditions.

Maximum Seated Height: 1.1 mm

The compact maximum seated height of 1.1 mm makes this product suitable for applications where space is limited.

Technology: ECL

Utilizing ECL technology ensures high-speed and low-power consumption performance, making this product efficient for digital logic operations.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this product has moderate sensitivity to moisture, making it suitable for controlled environments.

Technical Specifications

Logic Gates MC100EL12DTG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100EL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay (tpd):

.45 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100EL12DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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