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MC100EL01DG

Onsemi

MC100EL01DG by Onsemi

MC100EL01DG by Onsemi is a logic gate with 4 inputs, 0.33 ns propagation delay, and operates at -40 to 85 °C. It is used in industrial applications requiring fast signal processing in a small outline package.

Median Price

$3.466

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 59 parts In-Stock

1+ parts

$2.633

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-

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59

$2.633

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Chip1Stop

Japan . 9 parts In-Stock

1+ parts

$3.710

100+ parts

$3.580

1k+ parts

$3.550

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-

9

$3.710

$3.580

$3.550

-

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$5.630

100+ parts

$4.030

1k+ parts

$3.390

10k+ parts

$3.370

200

$5.630

$4.030

$3.390

$3.370

DigiKey

USA . 29 parts In-Stock

1+ parts

$6.120

100+ parts

$3.950

1k+ parts

$3.623

10k+ parts

$3.455

29

$6.120

$3.950

$3.623

$3.455

Flip Electronics (Authorized)

USA . 19,796 parts In-Stock

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Verical

USA . 11,172 parts In-Stock

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$3.221

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$3.221

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Rochester

USA . 253 parts In-Stock

1+ parts

-

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$3.190

1k+ parts

$2.860

10k+ parts

$2.690

253

-

$3.190

$2.860

$2.690

Avnet

USA . 196 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,367 parts In-Stock

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$3.382

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2,367

$3.382

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Flip Electronics

USA . 11,075 parts In-Stock

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11,075

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Vyrian

USA . 8,892 parts In-Stock

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NAC Semi

USA . 588 parts In-Stock

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-

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$9.480

1k+ parts

$8.540

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588

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$9.480

$8.540

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ComSIT Distribution GmbH

Germany . 98 parts In-Stock

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98

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Prism Electronics

USA . 5 parts In-Stock

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5

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Semi Source

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,821 parts In-Stock

1+ parts

$0.187

100+ parts

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2,821

$0.187

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Corohmni

South Africa . 490 parts In-Stock

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$0.220

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490

$0.220

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Benley Electronics

USA . 1 parts In-Stock

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$1.000

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1

$1.000

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Corphita

USA . 1,565 parts In-Stock

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$3.204

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1,565

$3.204

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Component Stockers USA

USA . 520 parts In-Stock

1+ parts

$3.340

100+ parts

$3.410

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520

$3.340

$3.410

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Microchip USA

USA . 1,012 parts In-Stock

1+ parts

$18.088

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1,012

$18.088

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SupplyDigital Components

Austria . 7,850 parts In-Stock

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7,850

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TANS Electronics

Latvia . 5,481 parts In-Stock

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Problanco Electronics

Mexico . 5,329 parts In-Stock

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Kulean Microsystems

USA . 1,635 parts In-Stock

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1,635

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UHIMA Technologies

Türkiye . 799 parts In-Stock

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799

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Perfect Parts

USA . 283 parts In-Stock

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Eastek

USA . 196 parts In-Stock

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Overview

Experience the unbeatable quality and performance of the MC100EL01DG logic gate by Onsemi. With a fast propagation delay of 0.33 ns and a wide operating temperature range, this small outline package is perfect for industrial applications. Onsemi's reputation for excellence shines through in every aspect of this product, from the durable plastic/epoxy body to the dual terminal position for easy installation. Customers can trust in the reliability and efficiency of the MC100EL01DG, making it the ideal choice for their logic gate needs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.37 ns

Low propagation delay helps in fast signal processing, making this product suitable for high-speed applications.

No. of Inputs: 4

Having 4 inputs allows for more complex logic operations to be performed, providing flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with many existing circuits and systems.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold temperatures, making it suitable for use in harsh environments.

Technology: ECL

Emitter-coupled logic technology offers high-speed performance and low power consumption, making the product efficient and reliable.

Technical Specifications

Logic Gates MC100EL01DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

.37 ns

Propagation Delay (tpd):

.33 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EL01DG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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